Director, Advanced Power Silicon & Packaging Technology

Position Summary The Director of Advanced Power Silicon & Packaging Technology leads the strategy, architecture, development, and deployment of next-generation power delivery technologies spanning silicon, package, and system integration. This role is responsible for driving innovation in power semiconductors, advanced packaging, and silicon-package-system co-optimization for AI, datacenter, networking, and high-performance computing platforms. The director partners across silicon design, packaging, architecture, manufacturing, and product organizations to deliver breakthrough improvements in power efficiency, power density, performance, reliability, and total cost of ownership. Key Responsibilities Technology Strategy & Vision Define and execute the long-term roadmap for:Advanced power silicon technologiesAdvanced packaging and heterogeneous integrationChip-package-system co-designVertical power delivery solutionsIdentify disruptive technologies and assess strategic investment opportunities.Drive technology differentiation and competitive advantage. Power Silicon Leadership Drive adoption of advanced semiconductor technologies including:GaN power devicesSiC technologiesAdvanced CMOS and BCD power processesOptimize power efficiency, die area, and reliability. Advanced Packaging Leadership Establish packaging technology roadmaps for:2.5D and 3D packagingChiplet architecturesSilicon interposersFan-out packagingEmbedded power deliveryCo-packaged solutionsLead package electrical, thermal, and mechanical optimization.Drive package innovations enabling higher power density and lower power delivery losses. Silicon-Package-System Co-Design Lead cross-functional initiatives to optimize:Power integrity (PI)Signal integrity (SI)Thermal performanceElectromigration reliabilityPower delivery network (PDN)Develop end-to-end power architectures from regulator to transistor. Research & Innovation Lead advanced technology incubation and proof-of-concept programs.Build strategic partnerships with:Semiconductor foundriesOSAT partnersEDA vendorsUniversities and research institutionsCreate and manage intellectual property portfolios.Drive patent generation and technical publications. Organizational Leadership Establish a culture of technical rigor, innovation, accountability, and execution excellence.Mentor senior technical leaders and develop organizational capability. Required Qualifications Education BS in Electrical Engineering, Physics, Materials Science, or related discipline.MS or PhD preferred. Experience 15+ years of semiconductor and power technology experience.6+ years leading technology, architecture, or engineering organizations.Proven success delivering innovative silicon and packaging technologies from concept through production. Technical Expertise Power Silicon Power semiconductor devicesPower integrity analysis Advanced Packaging Chiplet integration2.5D/3D packagingFan-out technologiesSilicon interposersPackage reliability and qualification Systems Knowledge Power delivery networksThermal managementManufacturing and supply chain considerations Preferred Qualifications Expertise in:Vertical power deliveryBackside power distribution networksEmbedded voltage regulationStrong patent portfolio and industry recognition.Participation in IEEE, OCP, JEDEC, or semiconductor standards organizations. More information about NXP in Greater China...