Senior Director, Advanced Packaging Disruptive Technology

Key Responsibilities

• Panel Scaling Technology Strategy & Roadmap Ownership
• Own the panel scaling technology roadmap across form factor scaling, interconnect scaling, and substrate scaling, including transitions from wafer-based approaches to panel-based architectures.
• Define technology inflections and integration milestones for advanced panel build-up and align internal roadmaps to customer adoption cycle
• Ecosystem & Partnership Development
• Build and manage a partner ecosystem spanning substrate makers, material suppliers, OSATs, foundries, and research institutes to close panel scaling gaps (design rules, warpage, overlay, defectivity, metrology/inspection, reliability).
• Identify, evaluate, and activate disruptive partners and collaborations to accelerate panel readiness and strengthen differentiation.
• Program Governance & Executive Communication
• Lead executive-ready storytelling and decision frameworks
• Drive internal alignment across engineering, product lines, marketing, and finance on portfolio gaps and priorities required to lead in advanced panel packaging.

Functional Knowledge

• Demonstrates broad and comprehensive understanding of different systems, theories and practices regarding advanced packaging as well as the changing business environment

Business Expertise

• Applies in-depth advanced packaging knowledge, business and commercial expertise to differentiate itself from the competition

Leadership

• Visionary Business & Technology Leader: Shapes strategy at the intersection of advanced technology and customer value, turning complex challenges into scalable, market-leading solutions.
• Trusted Executive Partner: Builds credibility with C-suite leaders, customers, and partners through clear communication, strong judgment, and a collaborative leadership style.
• Decisive Change Agent: Thrives in fast-paced, ambiguous environments—driving alignment, making high-impact decisions, and delivering results.
• People-First Leader: Inspires and develops world-class teams, fostering a culture of innovation, accountability, and continuous growth.

Problem Solving

• Evaluates key business challenges; directs the development of new or innovative solutions

Impact

• Guided by company strategy and business objectives, impacts results of segment/function

Interpersonal Skills

• Influences and negotiates at the top executive levels, with great latitude on outcomes; presents and defends complicated or delicate issues

Core Qualifications

• 15+ years experience in semiconductor packaging, substrates, panel processing, lithography/patterning, deposition/etch, or adjacent advanced manufacturing domains.
• Demonstrated leadership in technology strategy + customer execution (principal-level account leadership, platform adoption, or roadmap ownership).
• Strong working knowledge of advanced packaging drivers: panel form factor scaling, RDL scaling, TGV/glass & organic substrate trends, and manufacturing/yield constraints at large format
• Proven ability to lead cross-functional organizations and influence without direct authority across engineering, product teams, and external partners.
• Executive communication strength: translating complex technical tradeoffs into business outcomes and decisions.

Preferred Qualifications

• PhD/MS in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or equivalent experience.
• Prior experience launching new platforms (e.g., panel-based process modules, integrated packaging lines, or disruptive substrate architectures)
• Demonstrated track record of ecosystem building (materials, substrate suppliers, research institutes, foundries/OSATs)