Career Accelerator Program - Packaging Engineer

About the Role

The TMG Development program is a 12‑month program for new college graduates in the TMG organization at Texas Instruments. Participants join the Career Accelerator Program (CAP) for professional and technical training, function‑specific technical training, and on‑the‑job learning. The role involves interfacing across various work areas and organizations to help design, develop, and analyze semiconductor packaging technologies that enable differentiation for TI’s analog and embedded processing products. Packaging engineers work in a fast‑paced, dynamic environment that requires high‑energy, prioritization skills, and adaptability.

Responsibilities

• Partner with businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs, and other advanced packages at different stages of readiness.
• Participate in cross‑functional teams supporting product qualification and production, helping meet reliability and yield requirements, design testability, and test coverage.
• Direct design‑of‑experiments and collaborate with material suppliers to down‑select innovative packaging materials that enhance reliability and performance of advanced packages.
• Conduct electrical, mechanical, and thermal modeling to understand silicon‑to‑package interaction, establish design rules, and predict/prevent high‑risk designs.

Minimum Requirements

• Bachelor’s degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering, or a related field.
• Cumulative GPA of 3.0/4.0 or higher.

Preferred Qualifications

• Basic understanding of statistical process control (SPC).
• Knowledge of semiconductor packaging (manufacturing processes, assembly, reliability, materials, characterization, failure analysis).
• Demonstrated analytical and problem‑solving skills.
• Strong written and verbal communication abilities.
• Ability to work effectively in teams and collaborate across functions.
• Strong time‑management skills that enable on‑time project delivery.
• Ability to build strong, influential relationships.
• Capacity to thrive in a fast‑paced, rapidly changing environment.
• Initiative and a drive for results.

Benefits

Texas Instruments offers competitive pay and a comprehensive benefits package designed to help you and your family live your best life. Your well‑being is a priority, and country‑specific benefits information is available through the company’s benefits portal.

About Texas Instruments

Texas Instruments Incorporated (NASDAQ: TXN) is a global semiconductor company that designs, manufactures, and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics, and communications equipment. The company’s mission is to create a better world by making electronics more affordable through innovative semiconductor solutions that are reliable, low‑power, and cost‑effective.

About the Team

TI does not make recruiting or hiring decisions based on citizenship, immigration status, or national origin. If export‑control restrictions would require a license for this position, TI reserves the right to offer a different role that does not require such a license or to decline to move forward with the employment process.