Automatic Die Attach Operator 3 - 2nd Shift

About the role

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high-performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks. MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates. Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Position Overview: The Assembler 3 – Datacon Auto Die Attach Operations supports semiconductor die attach production using automated Datacon equipment in accordance with documented manufacturing procedures. This role loads materials, monitors automated die attach processes, verifies process outputs, and completes production documentation while complying with quality, safety, ESD, and semiconductor manufacturing standards. The position does not include manual assembly, soldering, laser marking, or laser serialization. Work is performed under direct to moderate supervision, depending on experience level.

Responsibilities

• Operate Datacon auto die attach equipment in accordance with drawings, travelers, work instructions, and process requirements.
• Load and handle wafers, substrates, die, tools, and related materials using approved semiconductor handling practices.
• Monitor automated die attach operations and verify placement accuracy, bond quality, alignment, and other process outputs using appropriate inspection tools.
• Execute work in compliance with semiconductor manufacturing requirements, including ESD control, contamination awareness, and process discipline.
• Identify and escalate equipment alarms, material issues, process deviations, or quality concerns to the appropriate lead, technician, or engineer.
• Accurately record production data and complete electronic and paper-based documentation to support traceability requirements.
• Maintain a safe, clean, and organized workspace in accordance with EHS and company policies.

Skills

• Basic understanding of semiconductor manufacturing, die attach, or precision automated equipment concepts.
• Ability to follow documented procedures, travelers, and verbal instructions.
• Basic computer proficiency (data entry, navigating manufacturing systems).
• Ability to operate Datacon auto die attach equipment after training.
• Understanding of ESD fundamentals and clean handling practices.

Qualifications

• High School diploma or equivalent.
• Ability to read, understand, speak, and write English fluently to support safety, quality, and documentation requirements.
• Ability to follow structured processes and work in a detail-oriented automated manufacturing environment.

Physical requirements & work environment

• Ability to perform repetitive tasks requiring careful material handling and attention to detail.
• Requires use of microscopes, inspection tools, and computer-based manufacturing systems for extended periods.
• Work will be performed in an ESD-controlled or clean manufacturing environment.

Benefits

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.