ALD Thin Film Process Development Engineer

About the role

Texas Instruments' Advanced Technology Development team is seeking an energetic engineer with a passion for process development to enable new technologies for future revenue growth. The position is based in Lehi, UT on the Process Development team, offering the opportunity to work on advanced semiconductor applications and influence process integration from early studies through full‑scale manufacturing.

Responsibilities

• Develop new processes and define processing and equipment requirements, specifications, and manufacturing methods for advanced semiconductor applications.
• Influence process integration schemes and support technology development from early paper studies and pilot work through full‑scale manufacturing.
• Translate business unit roadmap requirements into pathfinding and process development projects.
• Compile and evaluate test data to determine appropriate limits and variables for process or material specifications.
• Lead or support projects involving new process concepts, equipment selection, chemistry development, automation technologies, and novel manufacturing approaches.
• Provide technical engineering support in manufacturing and drive process and equipment modifications that improve production efficiency, technical capability, and yield.
• Develop and apply statistical methods, including Design of Experiments (DOE) and Statistical Process Control (SPC), to identify physical causes of yield loss and improve quality.
• Partner with equipment suppliers and vendors to define and execute equipment and process development roadmaps.
• Work across 300mm deposition platforms, including current single‑wafer ALD and CVD systems.

Qualifications

Minimum requirements:

• Master’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field.
• 5+ years relevant experience in 300mm Advanced (
• Working knowledge of process development, characterization and control of thin‑films processing equipment, CVD, PE‑CVD, single‑wafer ALD.
• Strong supplier engagement skillset.
• Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model‑based problem solving, engineering change control, and process release strategies.

Preferred qualifications:

• 5 years relevant experience in 300mm Advanced logic or advanced memory device technologies, with specific experience on RMG products.
• Working knowledge of advanced CMOS device physics and reliability mechanisms.
• Hands‑on process experience across multiple 300mm deposition platforms for dielectric, high‑K and metals.
• Experience with single‑wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as batch ALD platforms.
• Familiarity with 300mm semiconductor single‑wafer thermal, RTA, laser anneal systems.
• Direct R&D experience in 300mm semiconductors.
• Experience with HKMG, silicon photonics.
• Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization.
• Data analysis skills.
• Ability to work in teams and collaborate effectively with people in different functions and locations.
• Strong relationship‑building, communication, time management, and results‑oriented collaboration skills to enable on‑time project delivery.

Skills

• Statistical process control and Design of Experiments (DOE).
• Data analysis and model‑based problem solving.
• Supplier engagement and vendor partnership.
• Process development for thin‑films (CVD, PE‑CVD, ALD).
• Equipment selection and chemistry development.
• Automation technologies and novel manufacturing approaches.
• Technical communication and cross‑functional collaboration.
• Time management and results‑oriented project delivery.

Benefits

Texas Instruments offers competitive pay and benefits designed to help you and your family live your best life. Country‑specific benefit details are available via the provided link.