2027 Masters ASIC Package Engineering Co-op/Intern

AMD · San Jose, CA · 2 days ago

On-siteTrainingFull-time

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. As an intern or co-op, you’ll work alongside experts and industry pioneers, contributing to projects that impact millions of end-users worldwide.

About the role

We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with engineers in bringing new and advanced packaging technology to reality. This role is based in San Jose, CA or Santa Clara, CA and requires full-time (40 hours a week) onsite or hybrid work for the duration of the term.

Schedule

Spring/Summer Co-op: January 25, 2027 – August 13, 2027
Summer Internship (Semester Schools): May 24, 2027 - August 13, 2027
Summer Internship (Quarter Schools): June 21, 2027 – September 10, 2027
Summer-Fall Co-op (Semester Schools): May 24, 2027 – December 10, 2027
Summer-Fall Co-op (Quarter Schools): June 21, 2027 – December 10, 2027

Responsibilities

Support Package Design and Package Development Engineers in prioritizing and optimizing new projects.
Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates.
Work on design verification implementation to ensure design performance, quality, and efficiency.
Analyze yield and defect metrics to improve design performance and yield.
Evaluate and benchmark packaging materials and interact with partners to achieve cost-efficient designs for optimal performance and yield.

Requirements

Currently enrolled in a U.S.-based university in a Master’s degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
Knowledge or experience with any of the following technical skills (or related areas):
- Courses related to transmission lines and electric circuits.
- Package, silicon, or PCB design software.
- Scripting languages: Perl, Python, or SQL.
- Semiconductor theory and packaging process/technology.
- Data analytics and visualization tools like Power BI.

This role is not eligible for visa sponsorship.

Benefits