2027 Masters ASIC Package Engineering Co-op/Intern

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. As an AMD intern or co-op, you’ll work alongside experts and industry pioneers, contributing to projects that impact millions of end-users worldwide and gaining real-world experience that serves as a launchpad for your career.

About the role

We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and help bring new and advanced packaging technology to reality. This role involves supporting Package Design and Development Engineers in prioritizing and optimizing new projects, completing substrate, interposer, and bump designs, and contributing to design verification to ensure performance, quality, and efficiency.

Responsibilities

• Support Package Design and Development Engineers in prioritizing and optimizing new projects.
• Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates.
• Work on design verification implementation to ensure design performance, quality, and efficiency.
• Analyze yield and defect metrics to improve design performance and yield.
• Evaluate and benchmark packaging materials, interacting with partners to achieve cost-efficient designs and materials for optimal performance and yield.

Requirements

• Currently enrolled in a U.S.-based university in a Master’s degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field.
• This role is not eligible for visa sponsorship.

Skills

If you have knowledge or experience with any of the following (or related areas), we encourage you to apply:

• Coursework related to transmission lines and electric circuits.
• Package, silicon, or PCB design software.
• Scripting languages such as Perl, Python, or SQL.
• Semiconductor theory and packaging process/technology.
• Data analytics and visualization tools like Power BI.

Schedule

Spring/Summer Co-op: January 25, 2027 – August 13, 2027 (full-time, 40 hours per week).

Summer Internship:

• Semester Schools: May 24, 2027 – August 13, 2027.
• Quarter Schools: June 21, 2027 – September 10, 2027.

Summer-Fall Co-op:

• Semester Schools: May 24, 2027 – December 10, 2027.
• Quarter Schools: June 21, 2027 – December 10, 2027.

This role requires full-time, in-person or hybrid work at one of the following locations: Austin, TX; Boxborough, MA; Fishkill, NY (summer only); Fort Collins, CO; Longmont, CO; or Secaucus, NJ.

Benefits

For details on benefits offered, visit AMD benefits at a glance.