2027 Masters ASIC Package Engineering Co-op/Intern

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. As an AMD intern or co-op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers on projects that impact millions of end-users worldwide.

About the role

We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our engineers in bringing new and advanced packaging technology to reality.

Responsibilities

• Support Package design and Package Development Engineers in prioritizing and optimizing new projects
• Complete substrate, interposer, and bump designs for AMD products, test vehicles, and probe card substrates
• Work on design verification implementation to ensure design performance, quality, and efficiency
• Analyze yield and defect metrics to ensure design performance and help improve yield
• Evaluate and benchmark packaging materials and interact with partners to achieve cost-efficient designs and materials for optimal performance and yield

Requirements

• Currently enrolled in a US-based University in a Masters degree program majoring in Electrical Engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
• This role is not eligible for visa sponsorship

Skills

• Coursework related to transmission lines and electric circuits
• Experience with package, silicon, or PCB design software
• Knowledge of scripting languages (Perl, Python, SQL)
• Understanding of semiconductor theory and packaging process/technology
• Experience with data analytics and data visualization tools like Power BI

Schedule

• Spring/Summer Co-op: January 25, 2027 – August 13, 2027 (full time, 40 hours a week)
• Summer Internship (Semester Schools): May 24, 2027 - August 13, 2027
• Summer Internship (Quarter Schools): June 21, 2027 – September 10, 2027
• Summer-Fall Co-op (Semester Schools): May 24, 2027 – December 10, 2027
• Summer-Fall Co-op (Quarter Schools): June 21, 2027 – December 10, 2027

Location

Austin, TX or Boxborough, MA; summer only: Fishkill, NY; Fort Collins, CO; Longmont, CO; or Secaucus, NJ. This role requires in-person or hybrid work.

Benefits

For details on benefits offered, see AMD benefits at a glance.