Wafer Fabrication Process Technician (Photonics)

About the role

GPD Optoelectronics Corp. is seeking a Wafer Processing Operator to join their expanding team. This position involves various back-end wafer fabrication processes including dicing, scribing, testing, and certifying wafer lots.

Responsibilities

• Daily Operations: Wafer Thinning, Metallization, Dicing/Scribing, Grinding, Wafer probe, Pick-and-Place, and Wafer/Device Testing.
• Fabrication and testing of InGaAs and Germanium photodiodes, and other substrate materials.
• Use of a computer for testing and work order entry or quality details.
• Maintain Lot traceability through back-end operations.
• Manual handling of fragile parts.
• Report any problems or issues to support daily plans and prioritize tasks.
• Comply with GPD’s quality policies and adhere to safety measures.

Requirements

• Attention to detail and good manual dexterity for handling fragile substrates with tweezers.
• Ability to follow MIL-STD requirements, cleanroom protocol, and specific product specifications.
• High School Diploma (or equivalent).
• Experience processing group III-V and IV semiconductors.
• Ability to identify, multi-task, and resolve multiple priority issues quickly.
• Able to work in teams and collaborate effectively with people in different functions.

Qualifications

• LEAN OR Six Sigma experience desirable but not required.
• Chemical handling and adherence to safety measures, use of PPE, and adherence to regulations.
• Quality inspection experience a plus.

Skills

• Attention to detail and manual dexterity for handling fragile substrates.
• Attention to process safety and operating instructions.
• Quality inspection experience.

Benefits

Salary is commensurate with experience. The role requires wearing complete fab attire for an entire shift, including hand hygiene, personal item removal, gowning area preparation, and adherence to safety and cleanroom protocols.