​​Wafer Fab Technician – PECVD, Dry Etch & Wet Etch​

Location: Rowland, CA Position Summary The Wafer Fab Process Technician serves as a key production and technical leader whose primary responsibility is running volume production in support of daily wafer fabrication schedules, while also ensuring process stability, recipe control, and yield performance across InP photonic device lines, specifically InP Buried Heterostructure (BH) DFB lasers and BH Gain Chips (GC). The majority of this role’s hands-on time is spent operating the thin film and etch modules (PECVD dielectric deposition systems, ICP/RIE dry etch systems, and wet etch benches) to keep volume production lots moving on schedule, including the dielectric mask, Mesa etch, and surface preparation steps that support MOCVD epitaxial regrowth of InP current-blocking layers used to form the buried heterostructure, as well as dielectric passivation of the finished device. Operating with minimal supervision in a III-V cleanroom environment, the Technician plays a vital role in meeting fab throughput targets, leading root-cause investigations for process excursions, maintaining strict Process-of-Record (POR) discipline, and mentoring junior technicians and operators to support reliable, high-yield, high-volume manufacturing. Responsibilities PECVD, Dry Etch & Wet Etch Production Operations (50%): Serve as the primary production technician for the PECVD, dry etch, and wet etch modules, keeping InP BH DFB laser and BH GC wafer lots moving through volume production on scheduleOperate PECVD systems to deposit SiO2 and SiNx dielectric films used as etch/regrowth masks and passivation layers, maintaining film thickness, refractive index, uniformity, and stress within specification for every lotOperate ICP/RIE dry etch systems for dielectric mask patterning and InP/InGaAsP Mesa etch steps that directly support MOCVD epitaxial regrowth for buried heterostructure formation; control etch rate, selectivity, sidewall profile, and etch depthExecute wet etch and wet bench steps, including stripe etch, BOE oxide removal, resist strip, and pre-regrowth surface cleans, and maintain bench chemistry through scheduled bath changes and concentration checksPerform chamber cleans, seasoning, and scheduled preventive maintenance tasks on PECVD and dry etch tools, and qualify chambers with monitor wafers (particle, rate, and uniformity) prior to returning tools to productionPrioritize and sequence hot lots, engineering wafers, and standard production lots across the deposition and etch bays to sustain high tool utilization and meet daily/weekly throughput targetsPerform in-line film thickness, refractive index, etch depth, and defect inspection and first-wafer/first-lot qualification checks prior to releasing lots downstreamTroubleshoot routine PECVD, dry etch, and wet bench tool and process issues in real time to minimize downtime and protect production schedule adherence Advanced Process Troubleshooting & Root Cause (20%): Lead root-cause investigation for process excursions and drift across assigned process modules (e.g., PECVD film thickness or stress non-uniformity, dry etch rate or profile drift, particle adders, wet etch undercut variation)Design and run targeted process checks (short-loop wafers, engineering splits) to isolate root causePartner with Process Engineering and Equipment Engineering on corrective action design and verification Process Control & SPC Ownership (20%): Own SPC control charts and control-limit reviews for assigned process area, including PECVD film thickness, refractive index, and stress, dry etch rate and depth, and wet etch rate metricsOwn and maintain process recipes and POR documentation for assigned process area, with emphasis on PECVD deposition recipes and dry etch recipesEvaluate and implement engineering-approved recipe changes; verify post-change process stabilitySupport qualification of new or modified process steps DOE, Qualification & Training Support (10%): Support execution of DOEs, process qualifications, and NPI process runsTrain and mentor Operators on PECVD, dry etch, and wet etch production operation, process control methods, and troubleshooting technique Minimum Qualifications Associate degree in electronics, chemistry, materials science, or related technical field preferred; equivalent experience considered5 - 10 years of experience in semiconductor/photonics wafer processing, with direct III-V/InP process experienceDirect, hands-on experience operating PECVD and plasma dry etch (ICP/RIE) systems in a high-volume production environment strongly preferredHands-on wet etch and wet bench experience on III-V materials and dielectrics preferredStrong working knowledge of PECVD dielectric deposition (SiO2, SiNx), plasma dry etch, wet etch, and in-line fab process stepsHands-on proficiency operating deposition, etch, and metrology tools (ellipsometer/reflectometer, profilometer, SEM, defect inspection) in a volume production settingWorking knowledge of plasma etch behavior (rate, selectivity, profile, polymer and chamber conditioning effects) and of dielectric film properties and stressAbility to independently lead complex processes of troubleshooting and root-cause investigationsDemonstrated ability to sustain lot throughput and cycle-time targets in a high-volume deposition and etch production areaStrong ownership mentality and independent judgmentEffective communication with operators, technicians, and process and equipment engineersAbility to mentor and train junior staffAbility to work in a cleanroom environment for extended periods across multiple process bays, including sustained time in the PECVD and dry etch bays to support volume production paceAbility to work around chemicals (acids, solvents) and process gases with proper safety proceduresMay require flexibility to support engineering runs or excursions outside standard shift hours The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description. All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities. A reasonable estimate of the pay range for this position is $25 – $36. There are several factors taken into consideration in determining base salary, including but not limited to: job-required qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.