Wafer Fab Process Technician

About the role

GPD Optoelectronics Corp. is seeking a Wafer Processing Operator to join their expanding team. The position involves various back-end wafer fabrication processes including dicing, scribing, testing, and certifying wafer lots.

Responsibilities

• Daily Operations: Wafer Thinning, Metallization, Dicing/Scribing, Grinding, Wafer probe, Pick-and-Place, and Wafer/Device Testing
• Fabrication and Testing: InGaAs and Germanium photodiodes, other substrate materials
• Computer Usage: Testing and Work Order Entry
• Lot Traceability: Maintaining Lot traceability through back-end operations
• Handling Fragile Parts: Manual handling of fragile substrates with tweezers
• Problem Reporting: Reporting of any problems or issues with supporting daily plans
• Quality Compliance: Adherence to GPD’s quality policies
• Other Tasks: Additional tasks as assigned

Qualifications

• Attention to Detail and Manual Dexterity: Handling of fragile substrates with tweezers
• Process Safety Awareness: Understanding and following chemical handling and safety measures
• Quality Focus: Microelectronics or photonic device inspection experience a plus
• MIL-STD Requirements: Familiarity with MIL-STD requirements and cleanroom protocol
• Education: High School Diploma or equivalent

Skills

• Attention to Detail
• Manual Dexterity
• Process Safety Awareness
• Quality Focus
• Lean or Six Sigma Experience (desirable but not required)
• Team Collaboration
• Processing Group III-V and IV Semiconductors

Benefits

Salary commensurate with experience. Additional benefits may include:

• Able to lift up to 25lbs
• Complete Fab Attire Required: Hand Hygiene, Personal Item Removal, Gowning Area Preparation, Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns, Gloves, Additional Garments, Final Inspection

Pay

Salary is commensurate with experience.

Schedule

This is a full-time, non-exempt role located in Salem, NH.