Thermal Simulation Engineer

Responsibilities

• Thermal modeling and architecture
• Build and maintain thermal models of the optical engine spanning die, package, interface materials, lid, and cold plate, for air- and liquid-cooled configurations.
• Establish the cooling boundary condition methodology and its validity limits, and quantify thermal crosstalk from adjacent high-power devices.
• Resolve the temperature field across the photonic IC to the resolution photonic design requires, and own the resulting gradient and uniformity specifications.

Requirements

• MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent practical background.
• 6+ years of thermal simulation for semiconductor packages or electronic systems, including one product carried from architecture through hardware correlation.
• Expert proficiency in a commercial thermal or CFD tool for electronics: Ansys Icepak or Fluent, Simcenter Flotherm, Cadence Celsius, or equivalent.
• Command of heat transfer fundamentals sufficient to defend a model rather than only to run one.
• Demonstrated correlation of thermal simulation against measured hardware, with methodology revised on that basis.

Preferred Qualifications

• Silicon photonics or optoelectronic thermal work, particularly thermo-optic sensitivity and wavelength stability.
• Thermal design for small-footprint, high-flux die.
• Direct-to-chip liquid cooling and cold plate design or specification.
• 5D/3D package thermal modeling, and coupled electrothermal or thermal-structural workflows.
• First-generation product experience where the thermal methodology had to be established rather than inherited.