Jobs · Idaho

Technical Staff Lead - Advanced DRAM Overlay Engineer

TSP Talent · Boise, ID · 4 days ago
On-siteFull-time
Role Overview: The Lead Member of Technical Staff, Advanced DRAM Overlay Engineer is responsible for developing and deploying overlay solutions for future DRAM technologies. This role involves leading technical projects, influencing technology strategy, and mentoring engineers, with a focus on overlay development, specifications, measurement strategies, and process control methodologies. Key Responsibilities Develop overlay solutions for advanced DRAM and bonded device technologiesDesign overlay specifications and measurement strategiesApply modeling, experimentation, and data analysis to enhance overlay performanceCollaborate with lithography, metrology, process integration, bonding, and manufacturing teams to resolve technical challengesDrive supplier engagement and qualification of new overlay capabilities Qualifications & Skills Bachelor’s degree in engineering, physics, materials science, or related fields10+ years of experience in overlay, lithography, metrology, process integration, or semiconductor technologiesProficiency in data analysis, experimentation, and solving complex technical problemsStrong understanding of overlay control, process capability, and semiconductor manufacturing fundamentalsExcellent communication skills and ability to influence cross-team decisions Preferred Qualifications Master’s or PhD in relevant fieldsExperience with advanced DRAM, wafer bonding, or 3D integrationKnowledge of overlay error budgeting, distortion characterization, and advanced metrologyExperience with process automation, optimization, and applying AI in process development

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