Technical Sales Engineer (TSE) Intern - Summer 2027

About the role

NXP Global Sales transforms intelligent edge vision into market impact, delivering AI, secure edge intelligence, and breakthrough technologies to customers. The NXP Americas Global Sales Summer Internship is a 12‑week, paid program for rising juniors, seniors, and graduate students with a strong technical foundation. Interns are embedded in the Field Sales organization, paired with an experienced Technical Sales Engineer (TSE) mentor, and assigned real work from day one. The internship serves as a primary pipeline into NXP's Technical Sales & Applications Program (TSAP); strong performers may receive a return full‑time offer upon graduation. Locations include Field Sales Offices across the United States (e.g., Austin, TX; Detroit, MI; San Jose, CA) with hybrid work (in‑office + remote) and possible local customer travel.

Responsibilities

• Customer & Market Intelligence: Research and map target accounts within assigned territory or vertical market (Automotive, Industrial, or IoT); build stakeholder profiles and account maps for high‑priority prospects; develop competitive analyses and market landscape summaries to inform sales strategy.
• Sales Enablement & Tools: Create customer‑ready collateral — one‑pagers, pitch decks, and application notes — tailored by market segment; support sales operations by tracking customer pipeline data, design‑win funnel activity, and account status in Salesforce (CRM); build or refine dashboards and KPI tracking reports to support the regional sales team.
• Customer Engagement Support: Attend customer meetings, technical reviews, and product demonstrations alongside TSE mentors; prepare meeting agendas, capture action items, and assist with follow‑up communications; shadow and support evaluations, proof‑of‑concept activities, and NXP solution demos.
• Technical Learning & Application: Develop working knowledge of NXP product portfolios (MCUs, MPUs, wireless connectivity, analog, power management) and their applications; translate customer requirements into potential system‑level NXP solutions with guidance from your mentor; present your summer project findings to sales leadership in a final intern capstone presentation.

Requirements

• Currently pursuing a Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical field.
• Rising junior, senior, or graduate student — expected graduation between December 2027 and June 2029.
• Cumulative GPA of 3.0/4.0 or higher.
• Authorization to work in the United States (no sponsorship available for intern roles).
• Availability for 12 weeks full‑time during Summer 2027 (May–August).

Qualifications

• Coursework or project experience in embedded systems,