System IC Architect - Advanced Power Systems

Department: Advanced Power Systems (APS). This role focuses on Advanced Power Management System IC Architecture for Point of Load (PoL) solutions.

About the Role

We are seeking a visionary System IC Architect with deep expertise in system-level architecture, high-performance power conversion, and semiconductor packaging technologies. This role is pivotal in defining next-generation Point of Load (PoL) solutions for APS, driving innovation in advanced power management with System-in-Package (SiP) integration. The ideal candidate will define products, shape architecture strategy, and support the launch of Point-of-Load (PoL) power solutions that meet the latest system-level requirements. Key focus areas include high-performance core power for automotive applications and AI compute platforms. Expertise in AI compute power is essential, and experience in automotive power management is a strong plus.

Responsibilities

• Own System IC Architecture to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions, emphasizing Advanced Power Management for Point of Load (PoL) solutions.
• Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.
• Translate customer requirements into innovative packaging and power management solutions.
• Support development through thermal optimization and electrical analysis.
• Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
• Lead integration of ICs and power semiconductors into advanced packages and systems, with expertise in System-in-Package (SiP) integration.
• Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms. Knowledge of AI Compute Power Solutions is critical; automotive power management experience is a plus.
• Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability.
• Collaborate with system, modeling, design, packaging, and manufacturing engineering teams to validate and optimize high-performance compute power designs.
• Act as a technical liaison with customers, supporting co-development and design-in activities.
• Provide strategic insights on state-of-the-art power management technologies and benchmark readiness.
• Report KPIs and project status to executive stakeholders.

Qualifications

• Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
• 15+ years of experience in power semiconductors, packaging, and system-level integration, with expertise in System-in-Package (SiP) integration.
• Proven track record in product definition through revenue realization.
• Strong expertise in thermal management, electrical performance, and advanced reliability.
• Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.
• Experience in powering high-performance compute SoC platforms; automotive-grade standards are highly valued.
• Experience in systems developed according to Functional Safety standards (e.g., ISO 26262 and/or IEC 61508) is a plus.
• Demonstrated ability to lead cross-functional, global teams and manage complex projects.
• Excellent communication and interpersonal skills; ability to collaborate across diverse teams.
• Creative mindset with strong problem-solving capabilities.
• Willingness to travel globally.

Location

This position can be done from anywhere in the United States and is open to 100% remote work, though quarterly travel to our Chandler site and customer visits will be required. The role is also open to locations in EMEA, particularly France.