Systems IC Architect

Key Responsibilities

• Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions.
• Translate customer requirements into innovative packaging and power management solutions.
• Support development through thermal optimization and electrical analysis.
• Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
• Lead integration of ICs and power semiconductors into advanced packages and systems.
• Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms.
• Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability.
• Report KPIs and project status to executive stakeholders.

Preferred Qualifications

• Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
• 15+ years of experience in power semiconductors, packaging, and system-level integration.
• Proven track record in product definition through revenue realization.
• Strong expertise in thermal management, electrical performance, and advanced reliability.
• Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.
• Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.
• Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).
• Demonstrated ability to lead cross-functional, global teams and manage complex projects.
• Excellent communication and interpersonal skills; ability to collaborate across diverse teams.
• Creative mindset with strong problem-solving capabilities.
• Willingness to travel globally.