Staff PCB - Package co-design Engineer

About the role

We seek an experienced Electronics Engineer specializing in PCB Silicon packaging co-design to join Arm’s Packaging, Boards and Multiphysics team. You will be involved with systems that incorporate Arm processors, focusing on aspects like chip packaging and System-on-Chip (SoC) integration. We develop physical hardware platforms used for software development and validation activities for both external partners/customers and our internal development teams. The team is working at the forefront of embedded compute focusing on prototyping Arm's latest IP products.

Responsibilities

• Collaborate with engineering teams across multiple geographies to specify, evaluate, analyze and develop solutions for efficient PCB and silicon package integration to influence silicon architecture definition, package pinout trade-offs and system-level feasibility.
• Focus on driving the PCB development alongside the chip packaging team, including brainstorming breakout and routing strategies, design rules and layer optimization to ensure optimal performance, reliability, and cost-effectiveness.
• Provide timescale estimates and justifications into the program team.
• Analyze and optimize signal paths to ensure signal quality, minimize noise, and prevent signal degradation, especially at high speeds.
• Perform escape routing analysis of high-density SoCs and provide estimates of the IO count that can be routed with a particular stack-up and design rule set.
• Apply extensive knowledge of Signal and Power Integrity analysis techniques from both board design and chip packaging perspectives.
• Understand the PCB fabrication process (PTH and HDI), stackup/VIA topologies and substrate materials. Collaborate with PCB fabricators and CEM partners to assess manufacturability of advanced PCB technologies.
• Evaluate package pinout options against PCB routability, SI/PI performance, layer count, manufacturability, and cost. Define or review PCB layout guidelines and constraints.
• Support early silicon and board architecture planning, including component placement, form-factor constraints, PDN strategy, and routing feasibility.

Requirements

• Strong understanding of electronics and embedded compute systems.
• Familiarity with different IC packaging technologies and their impact on PCB design to ensure seamless integration of SoCs, ensuring proper signal routing and power delivery.
• Experience collaborating with chip packaging teams.
• Ability to influence and drive SoC device pin-outs for cost optimization, routing feasibility and layer trade-off analysis.
• Detailed knowledge of high-speed design and interface standards (e.g. PCIe and LPDDR memory technologies).
• Expertise in escape routing analysis of high-density SoCs and ability to provide estimates of the IO count that can be routed with a particular stack-up and design rule set.
• Extensive knowledge of Signal and Power Integrity analysis techniques from both board design and chip packaging perspectives.
• Understanding of the PCB fabrication process (PTH and HDI), stackup/VIA topologies and substrate materials.
• Proficiency in the use of EDA tools for schematic entry and PCB layout (Cadence OrCAD & Allegro).
• Good communication and interpersonal skills. Positive can-do attitude and attention to detail.

Desirable Skills

• Experience in using Signal Integrity tools from ANSYS, Siemens EDA etc.
• Experience of design automation and scripting.
• Enjoy collaborating and working across geographies with multiple teams.

Benefits

• Gain a deeper understanding of high-performance compute platforms.
• Work alongside other engineering teams in a friendly, supportive environment collaborating with highly motivated, like-minded engineers, producing high-quality designs incorporating Arm IP.
• Tackle new technical challenges faced when using advancing technologies.
• Hybrid working framework empowering teams to determine their own hybrid working patterns, depending on the work and the team’s needs.

Pay

Salary Range: $198,100-$268,000 per year. Salary is only one component of Arm's offering; the total reward package will be shared with candidates during the recruitment and selection process.