Staff Engineer - Dry Etch DRAM

Role: DRAM Dry Etch Engineer responsible for developing and optimizing plasma etch processes for next-generation memory devices. Key Responsibilities Develop and refine dry etch processes to meet structural and electrical specifications.Collaborate with process and integration teams to address device and process challenges.Perform root cause analysis, drive yield improvements, and resolve process issues.Analyze data to enhance process capability, stability, and manufacturing readiness.Support process transfer, project execution, and production problem-solving. Qualifications & Skills MS or PhD with 3–5 years of relevant experience, or BS with 5–10 years in semiconductor process development.Experience in dry etch process development within semiconductor manufacturing or R&D.Knowledge of plasma physics, dry etch chemistries, reactor fundamentals, and statistical data analysis.Ability to manage multiple projects and work effectively across teams. Preferred Skills Experience with DRAM processes and module ownership.Hands-on experience with ICP and CCP dry etch systems.Understanding of transport phenomena, surface interactions, and plasma processes.Proficiency with defect analysis methodologies and AI-driven process optimization.