Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs

Key job responsibilities

• Design and optimize hardware in our data centers.
• Provide leadership in the application of new technologies to large scale server deployments.
• Work with thought leaders in multiple technology areas to deliver a world-class customer experience.
• Lead the development of systems that are the heart of the world's largest and most powerful computing infrastructure.
• Develop from the lowest levels of circuit design to large system design including thermal and mechanical solutions.
• See systems through to high volume manufacturing.
• Shape the hardware that goes into our cutting-edge data centers affecting millions of AWS users.

Basic Qualifications

• Experience communicating with customers, technical, regulatory, business teams, and management to collect requirements, describe product features, and technical designs.
• Master's degree in mechanical engineering or equivalent.
• 5+ years industry experience in advanced packaging of semiconductors.
• Direct experience in designing and testing of test vehicles to assess future packaging architectures and evaluating properties of next-generation materials.
• Expertise in optimizing in packaging architectures to meet quality, performance, and cost goals.
• 10+ years industry experience in mechanical design of semiconductor-based systems – silicon, packaging, and system design.
• Industry experience of working with packaging component vendors and ODMs, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.
• Proficiency with simulation tools such as ANSYS, ABAQUS, COMSOL, FLOTHERM, ICEPACK or equivalent FEA/CFD software.

Preferred Qualifications

• Experience in advanced packaging metrologies for characterization, and design validation of semiconductor components, packages, and platforms. Hands-on experience with lab-based thermal and mechanical measurements, including instrumentation, infrared thermography, acoustic chambers, mechanical stress/strain gauges, power measurement equipment, and thermal test setups for package and system-level characterization.
• Strong understanding of product development lifecycles from concept through high volume manufacturing.
• Experience with various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies - including cold plate design. Working knowledge on fans, UQDs, manifolds, and CDUs.
• Developed detailed CFD and compact RC models for SoC and Package thermal analysis. Experience correlating simulation models with experimental data and iterating designs based on empirical findings.
• Demonstrated ability to design, set up, and execute experiments in a lab environment, including building custom test fixtures, operating data acquisition systems, and performing root-cause failure analysis on hardware. Experience with Design of Experiments (DOE) and Six Sigma methodologies.
• Knowledge of hardware and software based thermal / power management control algorithms.
• Validated thermal models through power/thermal measurements on Hardware.