Sr Staff Wafer Metrology Integration Lead Engineer

About Our Group

Do you want to work on cutting edge technology that pushes the limits of what a whole industry can do? You will have the exciting opportunity to help push the areal density of Seagate recording heads beyond that of any other competitor in the world. This is a Wafer Metrology and Control Integration Technical Lead position in our wafer process engineering metrology team and works closely with our HAMR and ATD process development teams. Our team's mission is to develop and implement metrology for wafer characterization and process control for state of the art recording technology. Recording head process technology encompasses all disciplines employed in semiconductor wafer processing, performed in a clean room environment.

Responsibilities

• Understand new process flows and product builds and how these can affect metrology and test performance.
• Leverage learning about current control methods earlier in development and looking for opportunities for innovation and improvement.
• Establish product and material characterization metrology roadmaps and identify critical gaps.
• Work with various process, design, metrology, product teams to drive closure of metrology gaps.
• Being an advocate for Metrology and Test requests and their priority in the overall workflow.
• Secure commitments on priorities and timelines for gap closure from relevant stakeholders.
• Work with metrology and process owners to identify and develop robust, accurate measurement processes on new transducer processes and designs.
• Lead cross-functional projects to assess and improve the effectiveness and efficiency of our process control methods through innovative combinations of measurements and factory control systems across the head supply chain from wafer to HGSA.
• Document the expected measurement and control methods at the product or process transfer readiness checkpoints between development, integration and process engineering. This includes preparing process control flow diagrams as well as input into Metrology and Factory Control Systems roadmaps and the Wafer Route Content Standards.
• Ensure cross-site and cross-functional collaboration towards successful implementation of the documented control plans and measurement content standards across both wafer sites.

Requirements

• Minimum 5+ years relevant experience in thin film related research or technology industry.
• Intimate knowledge of measurement techniques used in nanotechnology device fabrication for characterization and manufacturing control.
• Experience with data analysis applications and statistical analysis.
• Ability to lead multidisciplinary projects outside of nominal area of expertise.
• Ability to identify opportunities and gaps and develop and execute team plans to deliver solutions with minimal management guidance.
• Strong analytical skills.
• Strong leadership and communication skills.
• Strong documentation skills.
• BS degree in Physics, Materials Science, Electrical Engineering, Chemical Engineering or other relevant field with 12+ years of experience, MS degree with 8+ years of experience, or PhD degree with 5+ years of experience.

Preferred Qualifications

• Ability to deal with shifting priorities between stakeholders across functional boundaries.
• Additional experience in one or more of the following areas: mask design, thin film deposition, ion milling, ICP etch, plating, CMP, photolithography, design, and wafer metrologies.

Location

Normandale campus (Edina and Bloomington, Minnesota, United States). The campus serves as the Recording Head development and manufacturing arm of Seagate and offers an on-site café, fitness center with wellness programs, meditation rooms, indoor walking path, cultural festivals, celebrations, and community volunteer opportunities. Numerous restaurants and shopping are minutes away.

Pay

Estimated base salary range: $132,974.40 – $193,814.40 per year. Individual salary is based on work location and additional factors, including job-related skills, experience, and relevant education or training.

Benefits

• Eligibility to participate in discretionary bonus program
• Medical, dental, vision, and life insurance
• Short- and long-term disability
• 401(k)
• Employee stock purchase plan
• Health savings account
• Dependent care and healthcare spending accounts
• Paid time off including 12 holidays
• Flexible time off provided pursuant to Seagate policy
• Minimum of 48 hours of paid sick leave
• 16 weeks of paid parental leave

Benefits are based on a full-time schedule for a full calendar year and may differ depending on work location.

Travel

Up to 10% travel required.