Sr Staff Semiconductor Process Engineer

Basic Qualifications

Bachelors degree from an accredited college in Engineering, Physics, or related discipline.

Experience in semiconductor packaging or FPA manufacturing in a cleanroom environment with demonstrated expertise in either flip-chip hybridization techniques or related processes, such as epoxy die attach/bonding, polishing, substrate removal, or Anti-Reflection (AR) coating or semiconductor packaging techniques.

Must be a US Citizen, as this position is located at a facility that requires special access.

Job Description

You will be a Focal Plane Array Process Engineer with our Infrared Sensors Business on site in Goleta, CA. Our team is responsible for developing and manufacturing advanced Focal Plane Arrays (FPAs).

What You Will Be Doing

As a Staff FPA Process Engineer, you will be responsible for the technical and production leadership in the fabrication and execution of advanced Focal Plane Array (FPA) including wicking, plasma system, substrate thinning, dicing, Anti-Reflection (AR) coating, and flip-chip bonding for hybridization, a key step in the manufacturing process imaging devices.

Your Responsibilities Will Include, But Are Not Limited To

• Work with development and process integration engineers to adapt new processes and techniques into the manufacturing line as required.
• This may include defining requirements for new capabilities and organizing, leading, and executing FPA processing equipment capital procurement projects.
• Responsible for projects related to process definition, fabrication, modification and evaluation of FPA devices and components.
• Analyze test data, identify trends and anomalies, and provide feedback to drive process control and improvement initiatives.
• Contribute to the troubleshooting and failure analysis of FPAs, identifying root causes and implementing corrective actions.
• Develop and maintain documentation, including workflows, work instructions, and process control checklists, ensuring adherence to quality standards and industry protocols.

Why Join Us

We're looking for a collaborative and innovative Focal Plane Array Process Engineer to join our team. As a key member of our Infrared Sensors Business, you will have the opportunity to work on cutting-edge technology, contribute to the advancement of FPA technology, and collaborate with a team of experts.

Desired Skills

• 9+ years of industry experience OR advanced degree in Materials Engineering, Chemical Engineering, Mechanical Engineering, or Physics with 7+ years of industry experience.
• Background in IR FPA packaging, specifically flip-chip hybridization techniques.
• Knowledge of semiconductor device physics, photodetectors, and FPAs.
• Proficiency in MS Office (Word, PowerPoint, Excel).
• Excellent engineering documentation skills and communication skills.
• Ability to interface effectively from the technician level to senior management with excellent communication (written and verbal) and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and train technical staff.
• Experience leading multifunctional teams.
• Ability to multi-task, organize and prioritize assignments independently.
• Experience in Design of Experiments (DOE), statistical process control (SPC), and data analysis software packages (e.g., JMP).
• Experience with Lean/Six Sigma methodologies and data analysis software such as MATLAB or JMP.

Other Important Information

• By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match.
• Should this match be identified you may be contacted for this and future openings.
• Ability to work remotely
• Full-time: The work associated with this position will be performed onsite at a designated Lockheed Martin facility.