Sr Principal Semiconductor Equipment Engineer

About the role

Northrop Grumman Mission Systems is a trusted provider of mission‑enabling solutions for global security, offering secure, affordable, integrated, multi‑domain systems and technologies. The Sr. Principal Semiconductor Equipment Engineer will join the Advanced Packaging Technology Fab in Apopka, Florida, supporting semiconductor foundry and packaging lines that process Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide. The role involves leading engineering projects for equipment layout, cleanroom construction, installation, and ongoing maintenance of semiconductor equipment, managing contractors, and ensuring alignment with management.

Responsibilities

• Lead and manage engineering projects such as equipment layout, cleanroom construction, and installation of semiconductor equipment.
• Perform daily, weekly, bi‑weekly, quarterly, semiannual, and annual equipment maintenance.
• Oversee all aspects of facilities and factory layout for foundry equipment.
• Develop and apply continuous improvement programs.
• Manage project management activities, including working with and directing contractors/sub‑contractors and aligning with management.
• Run groups of tools, handling day‑to‑day maintenance/preventative maintenance (e.g., chemical management) and service contracts with vendors.
• Be flexible to work second shift as needed and be on call.
• Minimal travel – one to three short trips per year (approximately 10% of time).

Requirements

• Bachelor’s degree in a related STEM field with ≥8 years of relevant work experience; OR a master’s in a related STEM field with ≥6 years of relevant work experience; OR 12 years of relevant work experience in lieu of a degree.
• Minimum of 6 years of experience working with semiconductor fabrication equipment or the construction industry.
• Experience with semiconductor wafer fabrication facilities and operation.
• Experience with fab facility, equipment installation, and maintenance.
• Experience with Computerized Maintenance Management System (CMMS).
• Ability to obtain and maintain a Secret clearance.
• U.S. Citizenship required.

Qualifications

• Experience with semiconductor equipment.
• Experience with semiconductor clean‑room design and construction.
• Experience with Architecture and Engineering (“A&E”) drawing sets.
• Experience with AutoCAD design.
• Experience managing strategic projects from inception through completion, including financial, risk, and schedule management.
• Experience in low volume/high product mix environments.
• Experience interfacing with vendors for equipment repairs, service contracts, and purchases.
• Active Secret clearance (preferred).

Skills

• Strong leadership and communication skills.
• Ability to work with cross‑organizational teams (engineering, line maintenance, building maintenance).
• Flexibility to work second shift as needed and be on call.

Benefits

• Health Plan
• Savings Plan
• Paid Time Off (PTO)
• Additional Benefits: Education Assistance, Training and Development, 9/80 Work Schedule (where available)
• Health insurance coverage, life and disability insurance
• Company‑paid holidays
• Paid time off for vacation and/or personal business

Pay

• Base salary range: $122,800.00 – $184,200.00
• Eligible for overtime, shift differential, and discretionary bonus.
• Annual bonuses reward individual contributions and share in company results.
• Employees in Vice President or Director positions may be eligible for Long Term Incentives.

Schedule

• Standard full‑time schedule with potential for second shift as needed.
• On‑call availability required.
• Minimal travel – approximately one to