Sr. Hardware Engineering Manager
Hyve Solutions · Fremont, CA · 3 wk ago
Engineering$162k–$220k/yrFull-time
We need to output HTML fragment with sections: headings for sections like About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule. We must not repeat job title as heading. Must include sections only when posting has real specific content. Must not include filler like "commensurate with experience". Must preserve all substantive info. Remove boilerplate: EEO, etc. Also remove navigation, cookie, legal, application instructions. The posting includes: Hyve Company Overview, Role Overview, Core Responsibilities (list), Required Qualifications And Skills (list), Preferred Qualifications (list), Compensation: $162K to $220K DOE, What’s in it for you (list of benefits). Also maybe "Education", "Experience", etc under Required Qualifications.
We need to map to sections: About the role (maybe combine company overview and role overview?), Responsibilities (core responsibilities), Requirements (maybe required qualifications?), Qualifications (maybe required qualifications?), Skills (maybe technical breadth?), Benefits (list), Pay (compensation), Schedule (none? Not mentioned). So we should not create Schedule section because no info.
We must not repeat job title as heading. Use
for sections like About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule. We must not repeat job title as heading. Must include sections only when posting has real specific content. Must not include filler like "commensurate with experience". Must preserve all substantive info. Remove boilerplate: EEO, etc. Also remove navigation, cookie, legal, application instructions. The posting includes: Hyve Company Overview, Role Overview, Core Responsibilities (list), Required Qualifications And Skills (list), Preferred Qualifications (list), Compensation: $162K to $220K DOE, What’s in it for you (list of benefits). Also maybe "Education", "Experience", etc under Required Qualifications.
We need to map to sections: About the role (maybe combine company overview and role overview?), Responsibilities (core responsibilities), Requirements (maybe required qualifications?), Qualifications (maybe required qualifications?), Skills (maybe technical breadth?), Benefits (list), Pay (compensation), Schedule (none? Not mentioned). So we should not create Schedule section because no info.
We must not repeat job title as heading. Use for each section heading.
We need to preserve all substantive info: company overview, role overview, responsibilities list, required qualifications (education, experience, technical breadth, program management, leadership, communication), preferred qualifications list, compensation, benefits list.
We must not include EEO statement. Also remove "We are an Equal Opportunity Employer..." etc.
Also remove any duplicated lines.
We need to output only HTML fragment, no /, no markdown fences.
Let's craft sections:
About the role
maybe include company overview and role overview combined? Could split: maybe "About the company" but not required heading. The instruction says use headings for section headings (e.g. About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule). So we can have About the role (maybe includes company overview and role overview). Then Responsibilities (- ...). Then Requirements (maybe education and experience). Then Qualifications (maybe technical breadth, program management, leadership, communication). Then Skills (maybe same as qualifications? Might be redundant). But we need to avoid thin sections. Perhaps combine Requirements and Qualifications into one? But instruction says prefer few substantive sections over many thin ones. We could have sections: About the role, Responsibilities, Required qualifications, Preferred qualifications, Benefits, Pay. That seems reasonable.
We must not create Schedule.
We must not create Skills if not distinct; but we could include technical breadth under Required qualifications.
Let's decide:
- About the role: includes company overview paragraph and role overview paragraph.
- Responsibilities: list of core responsibilities bullet points.
- Required qualifications: education, experience, technical breadth, program management, leadership, communication (maybe as bullet list).
- Preferred qualifications: list.
- Benefits: list of benefits.
- Pay: compensation range.
We must ensure we preserve all specifics: numbers, years, etc.
Let's extract details:
Company Overview: "Hyve Solutions transforms complex engineering challenges into production reality for technology innovators building AI, cloud, and connected infrastructure. As a US-based manufacturing partner, the company rapidly delivers fast, agile execution through dep technical partnerships and co-innovation, and supply chain clarity. Hyve’s integrated ODM, CM, and SI capabilities eliminate vendor complexity while accelerating time-to-market with single-partner accountability from design through scale. The company co-innovates with deep engineering expertise, treating customer success as its own while building tomorrow's digital infrastructure."
Note: "dep technical partnerships" maybe typo but keep as is.
Role Overview: "Hyve Solutions is expanding its US-based design and engineering capability to support rapid growth in AI infrastructure for the world's largest Hyperscalers. The Senior Hardware Engineering Manager – AI Systems leads a multidisciplinary team of hardware engineers spanning board design, signal and power integrity, thermal, power delivery, and firmware, and is accountable for the day-to-day execution of next-generation GPU and compute server platforms from architecture through high-volume production. Where the Hardware Engineering Director sets organizational strategy across the US design organization, this role owns the engineering team and program delivery within it: building the bench, running the design reviews, and making sure platforms hit their EVT, DVT, and PVT commitments. It is a hands-on leadership position suited to an engineer who still enjoys reviewing a schematic or a channel simulation while managing the people who produce them."
Core Responsibilities bullet list:
- Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports.
- Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies.
- Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration.
- Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market.
- Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early.
- Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable.
- Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action.
Required Qualifications And Skills:
Education: Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.
Experience: 12 or more years of hardware engineering experience, including at least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production.
Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines.
Program management: Demonstrated ownership of multiple concurrent platform programs through EVT, DVT, and PVT, including schedule construction, risk management, and resource planning.
Leadership: A track record of attracting, developing, and retaining engineering talent, and of building team culture in a fast-growing organization.
Communication: Strong written and verbal communication, with the ability to represent engineering decisions to customers, partners, and senior leadership.
Preferred Qualifications:
- Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model.
- Experience standing up a new engineering team or site, including recruiting and onboarding at scale.
- Familiarity with liquid-cooled AI system design and rack-level integration.
- Experience operating across US and Taiwan engineering teams
Compensation: $162K to $220K DOE
What’s in it for you Benefit list:
- Insurance
- Flexible Spending Account (FSA)
- Health Savings Account (HSA)
- Mental Health Care
- 401K with match
- Paid Holidays, Vacation & Sick Days
- Tuition Reimbursement
- Perks at Work
- LEAP Program
- MyFlexPay
We need to output as
- for each.
We must not include EEO statement.
Now produce HTML:
About the role
Hyve Solutions transforms complex engineering challenges into production reality for technology innovators building AI, cloud, and connected infrastructure. As a US-based manufacturing partner, the company rapidly delivers fast, agile execution through dep technical partnerships and co-innovation, and supply chain clarity. Hyve’s integrated ODM, CM, and SI capabilities eliminate vendor complexity while accelerating time-to-market with single-partner accountability from design through scale. The company co-innovates with deep engineering expertise, treating customer success as its own while building tomorrow's digital infrastructure.
Hyve Solutions is expanding its US-based design and engineering capability to support rapid growth in AI infrastructure for the world's largest Hyperscalers. The Senior Hardware Engineering Manager – AI Systems leads a multidisciplinary team of hardware engineers spanning board design, signal and power integrity, thermal, power delivery, and firmware, and is accountable for the day-to-day execution of next-generation GPU and compute server platforms from architecture through high-volume production. Where the Hardware Engineering Director sets organizational strategy across the US design organization, this role owns the engineering team and program delivery within it: building the bench, running the design reviews, and making sure platforms hit their EVT, DVT, and PVT commitments. It is a hands-on leadership position suited to an engineer who still enjoys reviewing a schematic or a channel simulation while managing the people who produce them.
Responsibilities
- Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports.
- Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies.
- Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration.
- Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market.
- Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early.
- Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable.
- Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action.
Required qualifications
- Education: Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.
- Experience: 12 or more years of hardware engineering experience, including at least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production.
- Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines.
- Program management: Demonstrated ownership of multiple concurrent platform programs through EVT, DVT, and PVT, including schedule construction, risk management, and resource planning.
- Leadership: A track record of attracting, developing, and retaining engineering talent, and of building team culture in a fast-growing organization.
- Communication: Strong written and verbal communication, with the ability to represent engineering decisions to customers, partners, and senior leadership.
Preferred qualifications
- Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model.
- Experience standing up a new engineering team or site, including recruiting and onboarding at scale.
- Familiarity with liquid-cooled AI system design and rack-level integration.
- Experience operating across US and Taiwan engineering teams
About the role
maybe include company overview and role overview combined? Could split: maybe "About the company" but not required heading. The instruction says use headings for section headings (e.g. About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule). So we can have About the role (maybe includes company overview and role overview). Then Responsibilities (- ...). Then Requirements (maybe education and experience). Then Qualifications (maybe technical breadth, program management, leadership, communication). Then Skills (maybe same as qualifications? Might be redundant). But we need to avoid thin sections. Perhaps combine Requirements and Qualifications into one? But instruction says prefer few substantive sections over many thin ones. We could have sections: About the role, Responsibilities, Required qualifications, Preferred qualifications, Benefits, Pay. That seems reasonable.
We must not create Schedule.
We must not create Skills if not distinct; but we could include technical breadth under Required qualifications.
Let's decide:
- About the role: includes company overview paragraph and role overview paragraph.
- Responsibilities: list of core responsibilities bullet points.
- Required qualifications: education, experience, technical breadth, program management, leadership, communication (maybe as bullet list).
- Preferred qualifications: list.
- Benefits: list of benefits.
- Pay: compensation range.
We must ensure we preserve all specifics: numbers, years, etc.
Let's extract details:
Company Overview: "Hyve Solutions transforms complex engineering challenges into production reality for technology innovators building AI, cloud, and connected infrastructure. As a US-based manufacturing partner, the company rapidly delivers fast, agile execution through dep technical partnerships and co-innovation, and supply chain clarity. Hyve’s integrated ODM, CM, and SI capabilities eliminate vendor complexity while accelerating time-to-market with single-partner accountability from design through scale. The company co-innovates with deep engineering expertise, treating customer success as its own while building tomorrow's digital infrastructure."
Note: "dep technical partnerships" maybe typo but keep as is.
Role Overview: "Hyve Solutions is expanding its US-based design and engineering capability to support rapid growth in AI infrastructure for the world's largest Hyperscalers. The Senior Hardware Engineering Manager – AI Systems leads a multidisciplinary team of hardware engineers spanning board design, signal and power integrity, thermal, power delivery, and firmware, and is accountable for the day-to-day execution of next-generation GPU and compute server platforms from architecture through high-volume production. Where the Hardware Engineering Director sets organizational strategy across the US design organization, this role owns the engineering team and program delivery within it: building the bench, running the design reviews, and making sure platforms hit their EVT, DVT, and PVT commitments. It is a hands-on leadership position suited to an engineer who still enjoys reviewing a schematic or a channel simulation while managing the people who produce them."
Core Responsibilities bullet list:
- Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports.
- Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies.
- Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration.
- Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market.
- Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early.
- Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable.
- Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action.
Required Qualifications And Skills:
Education: Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.
Experience: 12 or more years of hardware engineering experience, including at least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production.
Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines.
Program management: Demonstrated ownership of multiple concurrent platform programs through EVT, DVT, and PVT, including schedule construction, risk management, and resource planning.
Leadership: A track record of attracting, developing, and retaining engineering talent, and of building team culture in a fast-growing organization.
Communication: Strong written and verbal communication, with the ability to represent engineering decisions to customers, partners, and senior leadership.
Preferred Qualifications:
- Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model.
- Experience standing up a new engineering team or site, including recruiting and onboarding at scale.
- Familiarity with liquid-cooled AI system design and rack-level integration.
- Experience operating across US and Taiwan engineering teams
Compensation: $162K to $220K DOE
What’s in it for you Benefit list:
- Insurance
- Flexible Spending Account (FSA)
- Health Savings Account (HSA)
- Mental Health Care
- 401K with match
- Paid Holidays, Vacation & Sick Days
- Tuition Reimbursement
- Perks at Work
- LEAP Program
- MyFlexPay
We need to output as
- for each.
We must not include EEO statement.
Now produce HTML:
About the role
Hyve Solutions transforms complex engineering challenges into production reality for technology innovators building AI, cloud, and connected infrastructure. As a US-based manufacturing partner, the company rapidly delivers fast, agile execution through dep technical partnerships and co-innovation, and supply chain clarity. Hyve’s integrated ODM, CM, and SI capabilities eliminate vendor complexity while accelerating time-to-market with single-partner accountability from design through scale. The company co-innovates with deep engineering expertise, treating customer success as its own while building tomorrow's digital infrastructure.
Hyve Solutions is expanding its US-based design and engineering capability to support rapid growth in AI infrastructure for the world's largest Hyperscalers. The Senior Hardware Engineering Manager – AI Systems leads a multidisciplinary team of hardware engineers spanning board design, signal and power integrity, thermal, power delivery, and firmware, and is accountable for the day-to-day execution of next-generation GPU and compute server platforms from architecture through high-volume production. Where the Hardware Engineering Director sets organizational strategy across the US design organization, this role owns the engineering team and program delivery within it: building the bench, running the design reviews, and making sure platforms hit their EVT, DVT, and PVT commitments. It is a hands-on leadership position suited to an engineer who still enjoys reviewing a schematic or a channel simulation while managing the people who produce them.
Responsibilities
- Team leadership. Manage and grow a team of board design, SI/PI, thermal, power delivery, and firmware engineers across Fremont and Portland, owning hiring, onboarding, coaching, and performance development for direct reports.
- Program execution. Drive delivery of GPU and compute server platform programs from architecture through EVT, DVT, PVT, and mass production, managing schedule, resource loading, quality, and cross-functional dependencies.
- Technical oversight. Provide hands-on technical direction across schematic, layout, SI/PI, thermal, power, and firmware deliverables, guiding design trade-offs and leading complex root-cause debug across hardware, firmware, and system integration.
- Design review discipline. Run design reviews and quality gates against Hyve's board design review framework (DR0.1 through DR1.0), and drive measurable improvement in first-pass success, yield, and time to market.
- Customer engagement. Act as a primary engineering point of contact for Hyperscaler counterparts on assigned platforms, communicating technical status, risks, and commitments clearly and early.
- Cross-geo collaboration. Partner closely with Taiwan design, operations, manufacturing, and validation teams so that designs are globally aligned, manufacturable, and scalable.
- Production ramp support. Work with Operations, Manufacturing, and Quality to scale from prototype to high-volume production, and support datacenter deployment with rapid issue triage and corrective action.
Required qualifications
- Education: Bachelor's or Master's in Electrical Engineering, Computer Engineering, or a related field.
- Experience: 12 or more years of hardware engineering experience, including at least 3 years directly managing hardware engineers with hiring and performance responsibility, and proven delivery of server, GPU, or accelerator platforms into high-volume production.
- Technical breadth: Working command of board design, high-speed interfaces (PCIe Gen5/Gen6, CXL, NVLink, Ethernet), power delivery networks, thermal design for both air and liquid cooling, and platform firmware, with the judgment to arbitrate trade-offs across those disciplines.
- Program management: Demonstrated ownership of multiple concurrent platform programs through EVT, DVT, and PVT, including schedule construction, risk management, and resource planning.
- Leadership: A track record of attracting, developing, and retaining engineering talent, and of building team culture in a fast-growing organization.
- Communication: Strong written and verbal communication, with the ability to represent engineering decisions to customers, partners, and senior leadership.
Preferred qualifications
- Direct experience supporting Hyperscalers or large cloud providers in an ODM or JDM model.
- Experience standing up a new engineering team or site, including recruiting and onboarding at scale.
- Familiarity with liquid-cooled AI system design and rack-level integration.
- Experience operating across US and Taiwan engineering teams
- for each.
We must not include EEO statement.
Now produce HTML: