Sr. Equipment Engineer CMP (Mult. Pos.) - Job# 5381

Responsibilities

• Solve critical equipment issues, improving tool uptime availability and utilization efficiency.
• Identify and pursue opportunities for hardware capability enhancement, driving defect reduction.
• Drive root causes and corrective action analysis on process escalations.
• Install and qualify new tool sets for the 5- nanometer or beyond equipment according to planned schedules and meet the process released standard.
• Communicate with cross-function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel.

Qualifications/Requirements

• Education and Work Experience:
  • Must have a Master’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 1 year of experience in an engineering role.
  • Alternatively, company will accept a Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 3 years of experience in an engineering role.
• Technical Skills:
  • Must have one (1) year experience with semiconductor manufacturing principles, practices and techniques as they relate to equipment engineering and maintenance.
  • Must have one (1) year of experience in the following 5nm technology or beyond in logic chip semiconductor industry: 5nm or more advanced tools maintenance, including preventive maintenance, troubleshooting, and equipment improvement; 5nm or more advanced tools qualifications and continue improvement project for tool ready to production.
  • Must have education or experience in the following: data analysis, and components and equipment selection; CMP basic principles and semiconductor manufacturing processes, capable of adjusting equipment parameters based on process requirements, with the ability to analyze and diagnose wafer surface defects (such as scratches and residues) and material removal rates; and specialized CMP equipment control interfaces and operating software, with basic operation and maintenance skills for robotic arms.
  • Must have one (1) year experience in at least 2 of the following software: C++; Python; UNIX; Creo 3D CAD; Pro-E; AutoCAD; MATLAB; COMSOL; OrCAD; or Solidworks.

Physical Requirements

• Candidates must be willing and able to work on-site at our Phoenix Arizona facility.

Work Location

5088 W. Innovation Circle, Phoenix, AZ 85083

Benefits

• A comprehensive and competitive benefits program that provides the resources you need to help you manage your health and achieve your goals across many areas of your life.
• Income-protection programs to financially assist you should you experience an injury or illness.
• A 401(k)-retirement savings plan to help you secure your financial future.
• Competitive paid time-off programs and paid holidays allowing you to recharge and spend time with your family and loved ones.

Equal Opportunity Employer

We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic.