Sr. Equipment Engineer CMP (Mult. Pos.) - Job# 5381

Responsibilities

• Solve critical equipment issues, improving tool uptime availability and utilization efficiency.
• Identify and pursue opportunities for hardware capability enhancement, driving defect reduction.
• Drive root causes and corrective action analysis on process escalations.
• Install and qualify new tool sets for the 5- nanometer or beyond equipment according to planned schedules and meet the process released standard.
• Communicate with cross-function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel.

Qualifications/Requirements

• Education and Work Experience: Must have a Master’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 1 year of experience in an engineering role. Alternatively, Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 3 years of experience in an engineering role.
• Technical Skills: Must have one (1) year experience with semiconductor manufacturing principles, practices and techniques as they relate to equipment engineering and maintenance. Must have one (1) year of experience in the following 5nm technology or beyond in logic chip semiconductor industry: 5nm or more advanced tools maintenance, including preventive maintenance, troubleshooting, and equipment improvement; 5nm or more advanced tools qualifications and continue improvement project for tool ready to production. Must have education or experience in the following: data analysis, and components and equipment selection; CMP basic principles and semiconductor manufacturing processes, capable of adjusting equipment parameters based on process requirements, with the ability to analyze and diagnose wafer surface defects (such as scratches and residues) and material removal rates; and specialized CMP equipment control interfaces and operating software, with basic operation and maintenance skills for robotic arms. Must have one (1) year experience in at least 2 of the following software: C++; Python; UNIX; Creo 3D CAD; Pro-E; AutoCAD; MATLAB; COMSOL; OrCAD; or Solidworks.

Physical Requirements

• Candidates must be willing and able to work on-site at our Phoenix Arizona facility.

Benefits

• A comprehensive and competitive benefits program that provides the resources you need to help you manage your health and achieve your goals across many areas of your life.
• Income-protection programs to financially assist you should you experience an injury or illness.
• A 401(k)-retirement savings plan to help you secure your financial future.
• Competitive paid time-off programs and paid holidays allowing you to recharge and spend time with your family and loved ones.

Work Location

5088 W. Innovation Circle, Phoenix, AZ 85083

About the Role

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

Pay

Competitive salary and benefits package.

Schedule

Standard Work Hours: 40 hrs/week, Mon-Fri, 8:30 a.m. - 5:30 p.m.