Sr Engineer Field Application Engineering

About the Company

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets.

About the Role

The GlobalFoundries Field Application Engineer (FAE) engages with GF's Power technology (BCD & leading-edge technologies like 22FDX and Finfet) customers early to assess technical needs and identify the best GF technical solution to drive opportunities toward design wins (DWIN) and tapeout. The FAE should understand and overcome any barriers to adoption the client may have for using GF technologies. The role involves cross-functional collaboration with internal GF technical experts to convert opportunities into revenue.

Responsibilities

• Engage with customers to understand their technical needs for semiconductor IC product development.
• Assess the competitive landscape to identify and advocate for GF’s winning value propositions.
• Partner internally with GF account managers, product marketing, and technical experts to create compelling, application-specific presentations on how GF technology solutions can support customer product development.
• Work closely with the account management team to merge technical and commercial terms into a design-winning proposal.
• Identify and resolve all issues or concerns to convert design wins into product tapeout.
• Advocate internally for improved features and capabilities of GF solutions where competitive gaps exist.
• Perform all activities in a safe and responsible manner, supporting all Environmental, Health, Safety, and Security requirements and programs.

Requirements

• Bachelor’s or Master’s degree in electrical engineering or equivalent (e.g., applied physics).
• Minimum of 5 years of experience in semiconductor design, tapeout, and process.
• Working knowledge of IC chip design flows and tools from architectural definition through performance characterization for BCD and leading-edge technologies like 22FDX and Finfet.
• Strong technical program management, active thinking, problem-solving, responsibility, ownership, teamwork, and communication skills.
• Up to 20% travel, primarily domestic with some international.
• Fluency in English (written and verbal).

Preferred Qualifications

• Master’s or PhD in electrical engineering or equivalent.
• 5+ years in semiconductor product design at the chip or module level, preferably in RF design.
• Direct experience in IC chip design flows and EDA tools from architectural definition through performance characterization.
• Exposure or experience in one or more of the following: Digital, Analog Mixed Signal, HV Power, eNVM, or Millimeter Wave IC product design.
• SoC product integration/design experience highly desirable.
• Strong project management skills, including the ability to innovate, execute, and navigate ambiguity.
• Excellent written and verbal communication skills, along with strong planning and organizational abilities.

Pay

Expected salary range: $67,000.00 – $109,000.00. The exact salary will be determined based on qualifications, experience, and location.