Jobs · Engineering · Oregon

Silicon Packaging Design Engineer

Intel · Hillsboro, OR · 3 days ago
On-siteEngineering$106k–$200k/yrFull-time

Key Responsibilities

  • Design and implement physical layout and routing of silicon interposers and embedded bridges.
  • Perform substrate fit and routing studies to evaluate design tradeoffs in performance, cost, and manufacturability.
  • Collaborate closely with silicon, technology development and hardware teams to optimize system-level design, including silicon-package-board integration and pinout.
  • Propose design updates and changes for rules and conduct internal and external reviews to ensure design feasibility.
  • Analyze design data and resolve design rule checks (DRCs) to achieve optimized and manufacturable package designs.
  • Utilize industry-leading electronic design automation (EDA) tools, including Virtuoso, Innovus, FusionCompiler, ICvalidator, and Calibre, to create robust package layouts.
  • Document processes and design specifications in the product lifecycle management system to ensure traceability and efficient collaboration.
  • Conduct reviews with partner teams to close milestone requirements

Qualifications

  • Bachelor's degree with 3+ years of experience OR Master's degree with 2+ years of experience in Electrical Engineering, Computer Engineering, or a STEM related field.
  • Experience listed above.
  • Proficiency in custom layout and Auto-place-and-route EDA tools including Virtuoso, Innovus, FusionCompiler, ICvalidator, and/or Calibre.
  • Experience with silicon physical layout design and development, routing interconnects, and/or review tools.
  • At least one of the following: 1+ year of experience with Analog/Mixed Signal fundamentals for signal integrity assessments and I/O fundamentals, 1+ year of experience of Power Distribution and power integrity assessments, 1+ year of experience of reliability requirements for interconnects.

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