SI/PI for 3DIC Sr Principle Solutions Engineer

About the role

This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions. The role is remote but requires being located in the US.

Responsibilities

• Analyze the customer's environment and evaluate appropriate solutions
• Develop creative solutions to technical issues before they become problems
• Take technical lead on a wide range of projects
• Understand and work with peers and other business groups on high-speed, high-performance signal and power integrity-related issues
• Communicate effectively with Cadence R&D, Product Engineering, Marketing, and customers
• Ensure customer success by understanding customer success criteria

Requirements

• Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
• Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design
• 5+ years experience with Cadence SI/PI tools and Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP
• Strong knowledge of advanced packaging concepts, 2.5D, 3DIC and stacked die technologies
• Understanding of chip level CMOS design concepts

Qualifications

• Knowledgeable and aware of competitive technologies
• Strong customer-facing communication and problem-solving skills
• Strong personal drive for continuous learning and expanding professional skill sets
• Excellent verbal and written communication skills

Skills

• Expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints

Benefits

• Paid vacation and paid holidays
• 401(k) plan with employer match
• Employee stock purchase plan
• A variety of medical, dental and vision plan options

Pay

• The annual salary range for California is $143,500 to $266,500

Schedule

• Remote role