SI/PI for 3DIC Sr Principle Solutions Engineer

About the role

This position involves defining and leading the development of advanced packaging and 3DIC analysis flows for foundry and customer solutions.

Responsibilities

• Analyze the customer's environment and evaluate appropriate solutions
• Anticipate technical issues and develop creative solutions before they become problems
• Take technical lead on a wide range of projects
• Understand high-speed, high-performance signal and power integrity-related issues, and work with peers and other business groups
• Communicate effectively with Cadence R&D, Product Engineering, Marketing and with customers
• Ensure customer success by understanding customer success criteria

Requirements

• Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
• Minimum 15 years experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to Package and PCB Design
• 5+ years experience with Cadence SI/PI tools Allegro platform tools including: Sigrity, Clarity, PCB Editor, ICP preferred
• Strong knowledge of advanced packaging concepts
• Strong knowledge of 2.5D, 3DIC and stacked die technologies
• Understanding of chip level CMOS design concepts desired

Qualifications

• Strong customer-facing communication and problem-solving skills
• Strong personal drive for continuous learning and expanding professional skill sets
• Excellent verbal and written communication skills

Skills

• Expert knowledge of the Cadence toolset and/or equivalent competitor toolsets in the context of multiple flows including high-speed signal design, power design, signal integrity, power integrity and definition of electrical constraints

Benefits

• Paid vacation and paid holidays
• 401(k) plan with employer match
• Employee stock purchase plan
• A variety of medical, dental and vision plan options

Pay

• The annual salary range for California is $143,500 to $266,500

Schedule

• Remote role but must be located in the US