Senior Thin Films Metals Deposition Engineer
for section headings (About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule)
- Use - for lists of duties/requirements/benefits, and
for prose
- Do NOT repeat the job title as a heading (page already shows it)
- Do NOT put Job ID / requisition numbers as headings — fold minor metadata into a short
or drop it
- Preserve ALL substantive information; do NOT invent or summarize away detail
- Remove cookie/navigation/legal/EEO/equal-opportunity/scam-warning boilerplate, duplicated lines, and application instructions
- Include a section ONLY when the posting has real, specific content for it — never emit a heading followed by filler/placeholder text (e.g. "commensurate with experience", "not specified", "N/A", "varies", "TBD")
- Never create Pay/Schedule/Benefits sections unless the posting actually states them
- Prefer a few substantive sections over many thin ones
- Output ONLY the HTML fragment — no /, no markdown code fences
Now, let me parse the job posting:
1. "About The Group" - describes MDCE organization
2. "About The Role" - describes the MDCE Metals Deposition Engineer role
3. "The Ideal Candidate Will Possess" - lists qualities (Leadership and Trust, Competency, Performance, etc.) - this seems like a "Qualifications" or "Skills" section
4. "Job Responsibilities Include But Are Not Limited To" - lists responsibilities
5. "Qualifications" - with Minimum Qualifications and Preferred Qualifications
6. "Job Type" - Experienced Hire
7. "Shift" - Shift 1 (United States of America)
8. "Primary Location" - US, Oregon, Hillsboro
9. "Additional Locations" - (empty)
10. "Posting Statement" - EEO boilerplate (remove)
11. "Position of Trust" - N/A (remove)
12. "Benefits" - describes total compensation package, health, retirement, vacation, link to more info
13. "Annual Salary Range" - $133,800.00 - 255,200.00 USD
14. "Work Model for this Role" - hybrid work model
15. "ADDITIONAL INFORMATION" - RBA compliance, no fees (boilerplate, remove)
Sections to include:
- About the role (from "About The Role")
- Responsibilities (from "Job Responsibilities Include But Are Not Limited To")
- Qualifications (from "Qualifications" with Minimum and Preferred)
- Skills/Attributes (from "The Ideal Candidate Will Possess" - this is a list of qualities)
- Benefits (from "Benefits" section - has real content)
- Pay (from "Annual Salary Range" - has specific range)
- Schedule/Work Model (from "Shift" and "Work Model for this Role" - has specific info)
- Location (from "Primary Location" - could fold into a short
or make a section)
The rules say: "use
for section headings (e.g. About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule)". So I should use these standard headings.
I need to decide on sections:
- About the role: yes, from "About The Role"
- Responsibilities: yes, from "Job Responsibilities Include But Are Not Limited To"
- Qualifications: yes, from "Qualifications" (minimum and preferred)
- Skills: from "The Ideal Candidate Will Possess" - this is a list of attributes, could be "Skills" or "Attributes"
- Benefits: yes, has real content
- Pay: yes, has specific salary range
- Schedule: yes, has shift and work model info
- Location: could be a short
at top or bottom, but not a heading unless it's a section. The rules say "fold minor metadata into a short
or drop it". Job Type, Shift, Primary Location are metadata. I'll fold them into a short
at the beginning or end.
Also "About The Group" - this is about the organization, not the role. Could be part of "About the role" or separate. The rules say "About the role" as a heading. I'll include "About The Group" as part of the role description or as a separate paragraph.
Let me structure:
1. Short
with metadata: Job Type, Shift, Primary Location
2.
About the role
- combine "About The Group" and "About The Role"
3. Responsibilities
- list from job responsibilities
4. Qualifications
- with Minimum and Preferred subsections (maybe use ? But rules only mention for section headings. Could use for Qualifications and then with sub-lists or separate lists)
5. Skills
- from "The Ideal Candidate Will Possess"
6. Benefits
- from Benefits section
7. Pay
- from Annual Salary Range
8. Schedule
- from Shift and Work Model
But note: "The Ideal Candidate Will Possess" is a list of qualities, not exactly skills. Could be "Attributes" but the example headings include "Skills". I'll use "Skills" as heading.
Also, the "Qualifications" section has Minimum and Preferred. I'll present as two lists under Qualifications heading.
Now, remove boilerplate: Posting Statement (EEO), Position of Trust N/A, ADDITIONAL INFORMATION (RBA compliance), "Join us at Intel... Apply now", "Find out more about the benefits of working at Intel." (that's a link, but we can keep the description).
Also remove "Job posting details (such as work model, location or time type) are subject to change." - that's a disclaimer.
Now, write HTML.
Let me draft:
Job Type: Experienced Hire | Shift: Shift 1 (United States of America) | Primary Location: US, Oregon, Hillsboro
About the role
Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery.
The MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining.
Responsibilities
- Strategic Alignment and Customer-first Execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time.
- Synthesis of Diverse Information: Ability to gather diverse inputs, uplevel to the right strategic response.
- Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing). Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools.
- Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals.
- Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers. Establish strong working relationships.
- Industry Trends: Stay updated on relevant industry direction setting technologies.
- Rapid Execution: Conceptualize strategies and put them into motion swiftly to meet challenging schedules.
- Team Management: Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly.
- Work Together, in Person: Work together with team members in person to enable faster decision making and problem resolution.
Qualifications
Minimum Qualifications
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
- 4+ years direct experience in metals deposition modules.
- Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies.
- 3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
- Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield.
Preferred Qualifications
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable leading-edge foundry nodes.
- 5+ years of direct experience in a metals deposition module such as Contact/MOL metals (e.g., W, Co, Ru, liners/barriers), BEOL / Cu interconnect (e.g., Cu/Co/Ru/W, caps, barriers, seed), advanced liners/barriers/adhesion layers or conductive films in logic nodes.
- Experience with interconnect and MOL physics (RC performance, via/contact resistance, electromigration, reliability mechanisms) and their linkage to metals deposition and integration.
- Proven experience driving process development, optimization, and transfer to HVM.
- Experience supporting technology ramp or technology transfer from TD to HVM, including POR definition, process window characterization, and tool matching.
- Hands-on ownership of metals deposition equipment (e.g., multi-chamber PVD/CVD/ALD platforms) including qualification, matching, and release to production.
- Experience collaborating with equipment and materials suppliers on hardware changes, chamber design, or chemistry changes to improve yield, cost, or reliability.
- Cross-functional leadership experience including experience leading or contributing to cross-site and cross-functional task forces for yield excursions, defect reduction, or technology ramp and demonstrated ability to work closely with factory teams, module and technical program stakeholders to implement metals deposition solutions in HVM.
Skills
- Leadership and Trust: Strong leadership, resourcefulness, and the ability to manage extremely sensitive information.
- Competency, Performance: A high performer with a track record of significant accomplishments.
- Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation.
for prose - Do NOT repeat the job title as a heading (page already shows it) - Do NOT put Job ID / requisition numbers as headings — fold minor metadata into a short
or drop it - Preserve ALL substantive information; do NOT invent or summarize away detail - Remove cookie/navigation/legal/EEO/equal-opportunity/scam-warning boilerplate, duplicated lines, and application instructions - Include a section ONLY when the posting has real, specific content for it — never emit a heading followed by filler/placeholder text (e.g. "commensurate with experience", "not specified", "N/A", "varies", "TBD") - Never create Pay/Schedule/Benefits sections unless the posting actually states them - Prefer a few substantive sections over many thin ones - Output ONLY the HTML fragment — no /, no markdown code fences Now, let me parse the job posting: 1. "About The Group" - describes MDCE organization 2. "About The Role" - describes the MDCE Metals Deposition Engineer role 3. "The Ideal Candidate Will Possess" - lists qualities (Leadership and Trust, Competency, Performance, etc.) - this seems like a "Qualifications" or "Skills" section 4. "Job Responsibilities Include But Are Not Limited To" - lists responsibilities 5. "Qualifications" - with Minimum Qualifications and Preferred Qualifications 6. "Job Type" - Experienced Hire 7. "Shift" - Shift 1 (United States of America) 8. "Primary Location" - US, Oregon, Hillsboro 9. "Additional Locations" - (empty) 10. "Posting Statement" - EEO boilerplate (remove) 11. "Position of Trust" - N/A (remove) 12. "Benefits" - describes total compensation package, health, retirement, vacation, link to more info 13. "Annual Salary Range" - $133,800.00 - 255,200.00 USD 14. "Work Model for this Role" - hybrid work model 15. "ADDITIONAL INFORMATION" - RBA compliance, no fees (boilerplate, remove) Sections to include: - About the role (from "About The Role") - Responsibilities (from "Job Responsibilities Include But Are Not Limited To") - Qualifications (from "Qualifications" with Minimum and Preferred) - Skills/Attributes (from "The Ideal Candidate Will Possess" - this is a list of qualities) - Benefits (from "Benefits" section - has real content) - Pay (from "Annual Salary Range" - has specific range) - Schedule/Work Model (from "Shift" and "Work Model for this Role" - has specific info) - Location (from "Primary Location" - could fold into a short
or make a section) The rules say: "use
for section headings (e.g. About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule)". So I should use these standard headings. I need to decide on sections: - About the role: yes, from "About The Role" - Responsibilities: yes, from "Job Responsibilities Include But Are Not Limited To" - Qualifications: yes, from "Qualifications" (minimum and preferred) - Skills: from "The Ideal Candidate Will Possess" - this is a list of attributes, could be "Skills" or "Attributes" - Benefits: yes, has real content - Pay: yes, has specific salary range - Schedule: yes, has shift and work model info - Location: could be a short
at top or bottom, but not a heading unless it's a section. The rules say "fold minor metadata into a short
or drop it". Job Type, Shift, Primary Location are metadata. I'll fold them into a short
at the beginning or end. Also "About The Group" - this is about the organization, not the role. Could be part of "About the role" or separate. The rules say "About the role" as a heading. I'll include "About The Group" as part of the role description or as a separate paragraph. Let me structure: 1. Short
with metadata: Job Type, Shift, Primary Location 2.
About the role
- combine "About The Group" and "About The Role" 3.Responsibilities
- list from job responsibilities 4.Qualifications
- with Minimum and Preferred subsections (maybe use? But rules only mention for section headings. Could use for Qualifications and then with sub-lists or separate lists)
5. Skills
- from "The Ideal Candidate Will Possess"
6. Benefits
- from Benefits section
7. Pay
- from Annual Salary Range
8. Schedule
- from Shift and Work Model
But note: "The Ideal Candidate Will Possess" is a list of qualities, not exactly skills. Could be "Attributes" but the example headings include "Skills". I'll use "Skills" as heading.
Also, the "Qualifications" section has Minimum and Preferred. I'll present as two lists under Qualifications heading.
Now, remove boilerplate: Posting Statement (EEO), Position of Trust N/A, ADDITIONAL INFORMATION (RBA compliance), "Join us at Intel... Apply now", "Find out more about the benefits of working at Intel." (that's a link, but we can keep the description).
Also remove "Job posting details (such as work model, location or time type) are subject to change." - that's a disclaimer.
Now, write HTML.
Let me draft:
Job Type: Experienced Hire | Shift: Shift 1 (United States of America) | Primary Location: US, Oregon, Hillsboro
About the role
Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery.
The MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining.
Responsibilities
- Strategic Alignment and Customer-first Execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time.
- Synthesis of Diverse Information: Ability to gather diverse inputs, uplevel to the right strategic response.
- Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing). Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools.
- Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals.
- Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers. Establish strong working relationships.
- Industry Trends: Stay updated on relevant industry direction setting technologies.
- Rapid Execution: Conceptualize strategies and put them into motion swiftly to meet challenging schedules.
- Team Management: Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly.
- Work Together, in Person: Work together with team members in person to enable faster decision making and problem resolution.
Qualifications
Minimum Qualifications
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
- 4+ years direct experience in metals deposition modules.
- Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies.
- 3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
- Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield.
Preferred Qualifications
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable leading-edge foundry nodes.
- 5+ years of direct experience in a metals deposition module such as Contact/MOL metals (e.g., W, Co, Ru, liners/barriers), BEOL / Cu interconnect (e.g., Cu/Co/Ru/W, caps, barriers, seed), advanced liners/barriers/adhesion layers or conductive films in logic nodes.
- Experience with interconnect and MOL physics (RC performance, via/contact resistance, electromigration, reliability mechanisms) and their linkage to metals deposition and integration.
- Proven experience driving process development, optimization, and transfer to HVM.
- Experience supporting technology ramp or technology transfer from TD to HVM, including POR definition, process window characterization, and tool matching.
- Hands-on ownership of metals deposition equipment (e.g., multi-chamber PVD/CVD/ALD platforms) including qualification, matching, and release to production.
- Experience collaborating with equipment and materials suppliers on hardware changes, chamber design, or chemistry changes to improve yield, cost, or reliability.
- Cross-functional leadership experience including experience leading or contributing to cross-site and cross-functional task forces for yield excursions, defect reduction, or technology ramp and demonstrated ability to work closely with factory teams, module and technical program stakeholders to implement metals deposition solutions in HVM.
Skills
- Leadership and Trust: Strong leadership, resourcefulness, and the ability to manage extremely sensitive information.
- Competency, Performance: A high performer with a track record of significant accomplishments.
- Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation.
for Qualifications and then with sub-lists or separate lists)
5. Skills
- from "The Ideal Candidate Will Possess"
6. Benefits
- from Benefits section
7. Pay
- from Annual Salary Range
8. Schedule
- from Shift and Work Model
But note: "The Ideal Candidate Will Possess" is a list of qualities, not exactly skills. Could be "Attributes" but the example headings include "Skills". I'll use "Skills" as heading.
Also, the "Qualifications" section has Minimum and Preferred. I'll present as two lists under Qualifications heading.
Now, remove boilerplate: Posting Statement (EEO), Position of Trust N/A, ADDITIONAL INFORMATION (RBA compliance), "Join us at Intel... Apply now", "Find out more about the benefits of working at Intel." (that's a link, but we can keep the description).
Also remove "Job posting details (such as work model, location or time type) are subject to change." - that's a disclaimer.
Now, write HTML.
Let me draft:
Job Type: Experienced Hire | Shift: Shift 1 (United States of America) | Primary Location: US, Oregon, Hillsboro
About the role
Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery.
The MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining.
Responsibilities
- Strategic Alignment and Customer-first Execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time.
- Synthesis of Diverse Information: Ability to gather diverse inputs, uplevel to the right strategic response.
- Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing). Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools.
- Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals.
- Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers. Establish strong working relationships.
- Industry Trends: Stay updated on relevant industry direction setting technologies.
- Rapid Execution: Conceptualize strategies and put them into motion swiftly to meet challenging schedules.
- Team Management: Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly.
- Work Together, in Person: Work together with team members in person to enable faster decision making and problem resolution.
Qualifications
Minimum Qualifications
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
- 4+ years direct experience in metals deposition modules.
- Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies.
- 3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
- Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield.
Preferred Qualifications
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable leading-edge foundry nodes.
- 5+ years of direct experience in a metals deposition module such as Contact/MOL metals (e.g., W, Co, Ru, liners/barriers), BEOL / Cu interconnect (e.g., Cu/Co/Ru/W, caps, barriers, seed), advanced liners/barriers/adhesion layers or conductive films in logic nodes.
- Experience with interconnect and MOL physics (RC performance, via/contact resistance, electromigration, reliability mechanisms) and their linkage to metals deposition and integration.
- Proven experience driving process development, optimization, and transfer to HVM.
- Experience supporting technology ramp or technology transfer from TD to HVM, including POR definition, process window characterization, and tool matching.
- Hands-on ownership of metals deposition equipment (e.g., multi-chamber PVD/CVD/ALD platforms) including qualification, matching, and release to production.
- Experience collaborating with equipment and materials suppliers on hardware changes, chamber design, or chemistry changes to improve yield, cost, or reliability.
- Cross-functional leadership experience including experience leading or contributing to cross-site and cross-functional task forces for yield excursions, defect reduction, or technology ramp and demonstrated ability to work closely with factory teams, module and technical program stakeholders to implement metals deposition solutions in HVM.
Skills
- Leadership and Trust: Strong leadership, resourcefulness, and the ability to manage extremely sensitive information.
- Competency, Performance: A high performer with a track record of significant accomplishments.
- Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation.
Skills
- from "The Ideal Candidate Will Possess" 6.Benefits
- from Benefits section 7.Pay
- from Annual Salary Range 8.Schedule
- from Shift and Work Model But note: "The Ideal Candidate Will Possess" is a list of qualities, not exactly skills. Could be "Attributes" but the example headings include "Skills". I'll use "Skills" as heading. Also, the "Qualifications" section has Minimum and Preferred. I'll present as two lists under Qualifications heading. Now, remove boilerplate: Posting Statement (EEO), Position of Trust N/A, ADDITIONAL INFORMATION (RBA compliance), "Join us at Intel... Apply now", "Find out more about the benefits of working at Intel." (that's a link, but we can keep the description). Also remove "Job posting details (such as work model, location or time type) are subject to change." - that's a disclaimer. Now, write HTML. Let me draft:Job Type: Experienced Hire | Shift: Shift 1 (United States of America) | Primary Location: US, Oregon, Hillsboro
About the role
Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery.
The MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining.
Responsibilities
- Strategic Alignment and Customer-first Execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time.
- Synthesis of Diverse Information: Ability to gather diverse inputs, uplevel to the right strategic response.
- Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing). Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools.
- Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals.
- Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers. Establish strong working relationships.
- Industry Trends: Stay updated on relevant industry direction setting technologies.
- Rapid Execution: Conceptualize strategies and put them into motion swiftly to meet challenging schedules.
- Team Management: Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly.
- Work Together, in Person: Work together with team members in person to enable faster decision making and problem resolution.
Qualifications
Minimum Qualifications
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
- 4+ years direct experience in metals deposition modules.
- Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies.
- 3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
- Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield.
Preferred Qualifications
- Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
- Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable leading-edge foundry nodes.
- 5+ years of direct experience in a metals deposition module such as Contact/MOL metals (e.g., W, Co, Ru, liners/barriers), BEOL / Cu interconnect (e.g., Cu/Co/Ru/W, caps, barriers, seed), advanced liners/barriers/adhesion layers or conductive films in logic nodes.
- Experience with interconnect and MOL physics (RC performance, via/contact resistance, electromigration, reliability mechanisms) and their linkage to metals deposition and integration.
- Proven experience driving process development, optimization, and transfer to HVM.
- Experience supporting technology ramp or technology transfer from TD to HVM, including POR definition, process window characterization, and tool matching.
- Hands-on ownership of metals deposition equipment (e.g., multi-chamber PVD/CVD/ALD platforms) including qualification, matching, and release to production.
- Experience collaborating with equipment and materials suppliers on hardware changes, chamber design, or chemistry changes to improve yield, cost, or reliability.
- Cross-functional leadership experience including experience leading or contributing to cross-site and cross-functional task forces for yield excursions, defect reduction, or technology ramp and demonstrated ability to work closely with factory teams, module and technical program stakeholders to implement metals deposition solutions in HVM.
Skills
- Leadership and Trust: Strong leadership, resourcefulness, and the ability to manage extremely sensitive information.
- Competency, Performance: A high performer with a track record of significant accomplishments.
- Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation.