Senior Thin Films Engineer

About the role

Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across Intel's most advanced semiconductor technologies in volume manufacturing. You will spearhead the development, optimization, and manufacturability of critical thin film deposition processes, ensuring seamless transitions from early development to high-volume production while meeting Intel foundry customer requirements.

Key Responsibilities

• Lead thin film process excellence across CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment technologies.
• Operate at the nexus of Technology Development and High-Volume Manufacturing, driving breakthrough solutions for Intel 18A, Intel 3, 12nm, and next-generation technology nodes.

Strategic Technical Leadership

• Align technical vision with customer requirements and business objectives.
• Synthesize complex technical data to formulate and execute strategic responses.
• Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
• Deliver rapid execution of innovative solutions to meet challenging development timelines.

Cross-Functional Partnership

• Collaborate closely with Technology Development, High Volume Manufacturing, and Business Groups.
• Build strong relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers.
• Present technical findings effectively to diverse audiences from engineering teams to executive leadership.
• Foster in-person collaboration to accelerate decision-making and problem resolution.

Industry Leadership

• Stay current with semiconductor industry trends and emerging process technologies.
• Drive strategic initiatives that position Intel at the forefront of manufacturing innovation.
• Contribute to technology roadmaps through hands-on technical expertise and market insight.

Qualifications

• Minimum Qualifications: Master's degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field, 5+ years semiconductor industry experience with strong focus on thin film deposition processes, Proven experience in process development, technical leadership, and manufacturing engineering, Extensive background working with equipment suppliers (AMAT, LAM, ASM, TEL) on process optimization, Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions, Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
• Preferred Qualifications: Doctoral degree in Electrical, Mechanical, Chemical Engineering, Materials Science, or in a STEM related field with research publications and patent portfolio in thin film technologies, Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments, Proven track record delivering customized solutions across Technology Development and HVM organizations, Cross-functional leadership experience managing diverse stakeholder groups, Semiconductor foundry experience.

Pay

$133,800.00 - 255,200.00 USD

Schedule

Shift 1 (United States of America)

Location

US, Oregon, Hillsboro

US, Arizona, Phoenix