Senior Equipment Engineer - Thin Films

Key Responsibilities

• Drive equipment uptime and operational performance across Thin Films manufacturing equipment.
• Develop and execute preventative and corrective maintenance programmes.
• Troubleshoot complex equipment issues and implement long-term corrective actions.
• Create and maintain equipment specifications, procedures and maintenance documentation.
• Support spare parts planning and inventory requirements.
• Lead new equipment installation, qualification and startup activities.
• Manage equipment relocation and upgrade projects.
• Identify and implement equipment improvement initiatives that enhance reliability, throughput and operational efficiency.
• Partner with manufacturing and process teams to prioritise maintenance activities and minimise production disruption.
• Develop and maintain technician certification and training programmes.
• Support technician hiring, onboarding and skills development initiatives.
• Provide technical guidance and advanced troubleshooting support to maintenance teams.
• Promote best practices in equipment engineering and operational excellence.
• Work closely with production, process engineering and manufacturing teams to support fab performance objectives.
• Communicate equipment status, project updates and maintenance priorities through reports, presentations and shift pass-down activities.
• Support a culture of continuous improvement, teamwork and operational excellence.

About You

• 5+ years of experience supporting Thin Films or related semiconductor manufacturing equipment.
• A Bachelor's degree in Engineering or a related technical discipline.
• Equivalent military, technical or vocational training combined with significant industry experience will also be considered.
• Strong troubleshooting capabilities, including board-level diagnostics and system-level problem solving.
• The ability to interpret electrical, mechanical and system schematics for advanced fault analysis.
• Experience working within high-volume semiconductor manufacturing environments.
• Strong communication skills and a collaborative approach to problem solving.

Preferred Equipment Experience

• Experience supporting one or more of the following platforms: Applied Materials Centura BPSG, Applied Materials Ultima HDP, Applied Materials Tungsten Plug, Applied Materials Endura, Novellus Concept Two Sequel, AG Associates RTP Systems (8100 / 8108), KLA-Tencor RS and Stress Metrology Platforms.

Additional Experience

• Candidates with exposure to the following methodologies will be viewed favourably: Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), Semiconductor equipment reliability engineering, Preventative and predictive maintenance programmes.