Senior Test Hardware Engineer

About the role

A Hardware engineering position responsible for developing System Level Test (SLT) PCBs for Broadcom products targeted at hyperscale data center applications. Broadcom’s market-leading products are enabling the next generation of AI and cloud storage.

Responsibilities

• Collaborate with Product Test and Firmware/Software teams in SLT system architecture definition.
• Design and schematic capture of SLT and bench PCBs for new Broadcom integrated circuit products using Allegro CAD tools.
• Create and manage PCB component libraries using Allegro CAD tools.
• Design architecture – collect information on PCB design rules, requirements, and specifications from project stakeholders, including customers.
• Work with PCB layout and SI engineers to ensure PCB layouts meet all electrical requirements.
• Work with Mechanical engineers and vendors to evaluate mechanical constraints and thermal solutions.
• Audit PCB layouts to ensure PCB designs meet all design rule checks including component pinouts and footprints.
• Complete and maintain vendor deliverables for PCB fabrication and assembly. Ensure the integrity and archival of design files related to PCB manufacturing.
• Test manufactured PCBs and deploy to internal and external customers. Manage inventory of PCBs and test status.
• Debug and rework any necessary changes via ECOs.

Qualifications

• Minimum: Bachelor’s Degree in Electrical Engineering.
• 12+ years of experience developing PCBs through manufacturing and test.
• In-depth experience doing schematic capture using Allegro tools.
• Experience managing vendors in a PCB manufacturing process – Fabrication and Assembly.

Skills

• Have a systems-level vision beyond just electrical design, creating a test solution that incorporates HW, SW/FW, mechanical, and manufacturability concerns.
• Strong sense of design ownership. Enjoy collaborating with the engineers using your PCBs and working with them to generate feature improvements.
• General understanding of transmission lines. Experience implementing detailed via structures for BGAs and connectors is a plus.
• Familiar with current high-speed PCB design techniques like blind/buried vias and backdrilling. Understand SI pitfalls like channel loss and crosstalk and how to optimize designs to account for them.
• Good debug intuition and comfortable in an EE lab doing board bring-up. Know how to solder, run wires, and think on your feet. Familiar with common EE debugging equipment – DMMs, Oscilloscopes.
• Comfortable working with command-line Linux OS-based programs/scripting.
• Passion for continuous improvement and a commitment to creating quality output.
• Strong teamwork skills as part of a fast-moving, multi-site team.
• Understanding of hardware/software interfaces and common embedded software design constraints like memory, power, and speed.
• Understand the tradeoffs of Power Delivery Network (PDN) design for systems consuming 200+W of power per rail, 1-3kW+ overall – simulation skills relative to PDN would be a plus.
• Understand basic mechanical and thermal properties and tradeoffs involved in the design of complex, high-power PCBs.

Pay

The annual base salary range for this position is USD 129,400.00 to USD 207,000.00.

Benefits

• Discretionary annual bonus.
• Competitive new hire equity grant and annual equity awards, connecting your success directly to the company’s growth.
• Medical, dental, and vision plans.
• 401(K) participation including company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Company-paid holidays, paid sick leave, and vacation time.
• Paid Family Leave and other leaves of absence, in accordance with applicable laws.