Jobs · Engineering · Maryland

Senior Printed Circuit Board (PCB) Designer

All Aviation Jobs · Severn, MD · 3 days ago
Engineering$123k–$217k/yrFull-time

About the role

At Lockheed Martin Space, we are seeking an expert RF PCB Designer to lead the development of high speed, high frequency printed wire assemblies (PWAs) covering HF-Ka Bands (10MHz-40GHz).

Responsibilities

  • Own complete board level RF design cycles—from concept, schematic capture, through layout, fabrication while ensuring compliance with all applicable IPC standards and leveraging state of the art fabrication materials.
  • Drive best in class design for manufacturability (DFM) practices.
  • Mentor mid-level and junior RF PCB engineers.
  • Support the program’s security controlled environment.

Requirements

  • Hands on RF PCB design experience in HF-Ka Bands (10MHz-40GHz).
  • Demonstrated experience designing Printed Wire Assemblies (PWA) for high frequency/high power systems.
  • Proficiency with high frequency PCB layout tools (Altium Designer, Siemens Xpedition).
  • Solid understanding of transmission line theory, controlled impedance routing, via design, filter integration, and high speed signal integrity.
  • In depth familiarity with all IPC references listed above, including the ability to interpret and apply them to classified projects.
  • Materials Expertise: Practical knowledge of advanced PCB substrates and finishes (Rogers, Taconic, Isola, Nelco, Duroid, PTFE, ceramic, flexible rigid laminates) and the impact of material properties on loss, dielectric constant, thermal expansion, and reliability.
  • Excellent written and verbal communication, strong problem solving mindset, and ability to work cross functionally with RF, mechanical, firmware, and test teams.

Qualifications

  • Associates or Bachelor’s degree in Electrical/Electronic Engineering, or a closely related field.
  • 15+ years of hands on RF PCB design experience in HF-Ka Bands (10MHz-40GHz).
  • Certifications: IPC Designer Certification (CID), Certified RF Engineer (e.g., IEEE RF), or equivalent.
  • Tool Proficiency: Schematic capture as well as PCB layout experience with Siemens Xpedition, Zuken CR8000, Altium Designer, as well as SolidWorks PDM version control for PCB data CM systems.
  • Exposure to 3D printed RF structures, low temperature co fired ceramic (LTCC), embedded passive components, or integrated antenna in package designs.
  • Expertise in EM simulation (HFSS, CST, ADS Momentum, SIwave).
  • Proven ability to work in a Top Secret environment, handling classified data per DoD/National Security regulations.

Skills

  • Ability to obtain & maintain an active TS/SCI clearance.

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