Senior Principal Semiconductor Equipment & Process Integration Engineer

About the role

The Sr. Principal Semiconductor Equipment & Process Integration Engineer will work on cutting-edge gallium arsenide, gallium nitride-based devices, and III-V focal plane array fabrication. They will collaborate across engineering work centers in our III-V semiconductor wafer foundry to manage the complete lifecycle of tool acquisitions.

Responsibilities

• Lead, manage, and support projects throughout the capital equipment lifecycle, including source selection, acquisition, facilities infrastructure, installation, qualification, sustainment, and troubleshooting.
• Develop a capital roadmap to identify and implement process and equipment capabilities that enhance wafer capacity, product yield, and next-generation technology development.
• Drive initiatives in capital acquisition, process optimization, yield enhancement, rework reduction, equipment cost of ownership, and process development.
• Create and maintain schedules for tool and process qualifications while addressing capacity constraints and identifying opportunities for improvement.
• Collaborate with cross-functional teams to understand foundry processes, identify limitations, and improve overall equipment effectiveness and throughput.
• Conduct statistical analysis and manipulate large datasets to define SPC (Statistical Process Control) metrics, correlate equipment input parameters with process outputs, and improve yield, cycle time, process capability, and equipment uptime.
• Frequently work directly on the foundry floor to resolve technical issues and interface with teams from operations, facilities, environmental health and safety (EHS), equipment, and quality.

Requirements

• A typical requirement includes a Bachelor’s degree in Science, Technology, Engineering or Mathematics (STEM) or an Advanced Degree in a related field and minimum 5 years’ of prior work experience.
• A minimum of 8 years’ of work experience in semiconductor processing techniques and capital equipment including photolithography, dry etching, wet chemistry, metals evaporation, sputtering and backside processing.
• The ability to obtain and maintain a U.S. government issued security clearance post-start is required.
• U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Qualifications

• Experience managing and reporting on projects.
• Proven ability to lead cross-functional teams and execute improvement initiatives.
• Excellent communication and coordination skills.
• Familiarity with III-V semiconductor fabrication processes and techniques.
• Experience troubleshooting a wide range of fabrication equipment in addition to establishing equipment qualification and preventative maintenance procedures.
• Strong analytical and data-driven approach to problem-solving.
• Proficient in statistical process control and lean manufacturing methods (e.g., Six Sigma).
• Experience in a data analysis software package (e.g., FabGuard, SQL, JMP).

Benefits

Raytheon offers competitive compensation and comprehensive benefits packages, including medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays. Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.

Pay

The salary range for this role is $132,400 - $251,600.

Schedule

This 1st shift role will be 100% on-site and based in Andover, MA.