Senior Post Fab Module Engineer (MOSFET)

We are seeking a highly motivated and experienced semiconductor Senior Module Engineer to join our growing 300mm Post Fab team in East Fishkill, NY. This role is critical to improving device performance and driving best-in-class trench MOSFET technology as we develop new products and ramp volume manufacturing.

About the role

This position requires an engineer ready to step in as a leader within the team, with experience in wafer thinning, ultra-thin wafer handling, backside metallization, and managing stress and thermal effects on thinned wafers.

Responsibilities

• Own the process roadmap and module technology direction in EFK’s BGBM Post Fab.
• Set process standards across tools and areas of our line as the go-to expert with site-level authority to improve manufacturability of our MOSFET and IGBT technologies in our Post Fab back-grind, back-metallization line.
• Own control plans, PFMEA, and risk mitigation plans for thin wafers to enable robust high-volume manufacturing, including leading scaling from development to high-volume manufacturing and global replication.
• Evaluate and qualify new materials, processes, and equipment for our Post Fab back-end wafer operations.
• Troubleshoot process issues and implement corrective actions to improve yield and device performance.
• As Tool Owner, lead tool matching and variation reduction; own process windows across multiple platforms, and interface directly with suppliers on tool roadmaps.
• Self-manage technical projects and provide technical team leadership to other engineers in the organization.
• Communicate clear project plans and results to senior management.
• Collaborate with cross-functional teams including R&D, Quality, and Manufacturing to support new product introductions.
• Raise overall backend technical capability and influence engineering culture through mentorship of multiple engineers in the organization.
• Analyze process data and apply statistical methods to drive continuous improvement.
• Ensure compliance with safety and quality standards.

Requirements

• Bachelor’s or higher degree in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related field.
• 10 years of direct work experience in the semiconductor industry with specific experience in back-end processing of wafers, including wafer thinning, Al/Ti/NiV/Ag backside metallization stacks, and managing stress and thermal effects on thinned wafers.

Skills

• Strong understanding of semiconductor device physics and back-end wafer processes.
• Proficient in SPC, DOE, and data analysis tools.
• Demonstrated success in yield, throughput, and cost improvement initiatives.
• Proficient with structured problem-solving tools and their application to lead improvement actions that result in positive technology and business outcomes.
• Familiarity with standard metrology, inspection, and failure analysis techniques.
• Ability to own, lead, and drive product development and technology improvement.
• Self-motivated, detail-oriented, and results-driven.
• Strong communication skills, both written and verbal, and a collaborative mindset.
• Ability to work effectively in a team and provide hands-on support and mentorship to other engineering and operations staff.

Pay

The base salary range for this position is $127,800 to $217,200, exclusive of fringe benefits or potential bonuses. The final pay rate will depend on geographic location, skills, education, experience, and internal equity considerations.

Benefits

We offer a competitive benefits package. More details can be found at onsemi Benefits Summary.

About onsemi

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company accelerates change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.