Senior Physical Failure Analysis Engineer

Job Summary

The Physical Failure Analysis team at NVIDIA is seeking a Failure Analysis Engineer to join our world-class lab. The ideal candidate will perform PFA on advanced integrated circuits and system architectures, driving critical engineering solutions.

What You’ll Be Doing

• Pioneer Advanced FA Techniques & Methodologies
• Design and implement cutting-edge methodologies for root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.
• Precision De-processing
• Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.
• Nanoscale Analysis
• Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques to enable high-resolution electrical and physical diagnostics of IC chips.
• Innovate Characterization Platforms
• Develop novel characterization techniques and specialized analysis platforms tailored for emerging chip structures with advanced silicon architectures and complex packaging schemes.
• Optimize Workflows
• Design and implement robust failure analysis (FA) workflows to improve laboratory efficiency and guarantee accurate, reproducible root-cause determination.
• Conduct In-Depth FA Investigations
• Head high-impact failure analysis investigations to isolate the root causes of critical failures affecting product yield, performance, and long-term reliability.
• Support Multi-functional Engineering
• Deliver precise physical characterization data to support engineering teams with Design of Experiments (DOE) evaluations, design optimization, process node improvements, and critical customer FA requests.

Requirements

• Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies.
• Proven proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.
• Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM), alongside related analytical inspection techniques.
• Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.

Qualifications

• A B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a closely related field (or equivalent experience).
• At least 8 years of relevant, hands-on experience.

Benefits

Competitive salaries and a generous benefits package are offered. NVIDIA is widely considered one of the technology world's most desirable employers. The base salary range is 144,000 USD - 230,000 USD. Applicants can apply until July 13, 2026. This posting is for an existing vacancy. NVIDIA uses AI tools in its recruiting processes. NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.