Senior PCB Fabrication Engineer

About Qorvo

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. The company combines product and technology leadership, systems‑level expertise, and global manufacturing scale to quickly solve customers’ most complex technical challenges across consumer electronics, smart home/IoT, automotive, EVs, battery‑powered appliances, network infrastructure, healthcare, and aerospace/defense.

Role Overview

Qorvo is seeking a Senior PCB Fabrication Engineer with knowledge in PCB and/or IC substrate manufacturing processes for RF product applications. The position reports to Qorvo’s RF Packaging Center of Excellence in Greensboro, NC, and will work with suppliers to develop new substrate technologies from concept through high‑volume manufacturing.

Responsibilities

• Interface between Qorvo design teams and worldwide supply base to create technology roadmaps supporting future products.
• Develop, qualify, and support clean launch of new PCB material sets, design rules, capabilities, and suppliers in line with centralized Qorvo processes and documentation standards.
• Design material and surface‑finish evaluations using screening tests and design of experiments to improve RF performance, MSL rating, cost, or size.
• Utilize program‑management methodology to plan, execute, and monitor complex process and product development projects.
• Apply problem‑solving skills and knowledge to address challenges related to new technologies or improve existing supply‑chain capabilities.
• Travel to PCB suppliers to provide technical support for technology development, supplier qualification, and problem resolution.

Required Skills

• Ability to learn quickly in a high‑paced environment.
• Strong communication skills.
• Industry knowledge and experience with PCB manufacturing processes such as via drilling, copper pattern plating, panel plating, and surface finishes.
• Familiarity with a wide range of assembly/packaging process technologies and materials (e.g., SMT, die attach, wire bond/flip chip, molding, multi‑layer laminates) is a plus.
• Recognized understanding of IPC laminate/PCB standards.
• Experience developing design rules.
• Proficiency with SPC techniques, DOE, and structured problem‑solving methodologies (e.g., DMAIC, 8D).
• Understanding of Design for Manufacturability and requirements for ramping technologies in high‑volume manufacturing.
• Experience with Altium, KiCAD, Cadence, or other PCB design software.
• Effective project‑management skills.
• Proven record of supporting new product/process or technology through innovative packaging solutions.

Required Experience

• 5+ years of experience in PCB manufacturing, or an equivalent combination of an advanced degree and relevant education.
• Bachelor’s or higher degree in Chemistry or an Engineering discipline.

Job Location

This is an onsite, full‑time position with an expectation of five days per week on site. The preferred location is Greensboro, NC, but the role can also be based in Richardson, TX or Apopka, FL. The position is not eligible for visa sponsorship.