Senior Optical Packaging Engineer

About the role

Due to extensive growth, we are seeking a Senior Optical Packaging Engineer to oversee development of advanced packaging solutions including package design, material selection, fabrication processing, qualification, and documentation. You will work closely with design engineers, process engineers, supply chain, operations technicians, facilities, and outside consultants. Responsibilities include developing advanced packaging solutions for photodiode devices, electronics, and micro‑optics across various market segments, balancing demanding product requirements with reliability and cost. You will follow the NPI gate process, ensure products meet internal and customer specifications, and design for manufacturability. You will also ensure repeatability and reproducibility of products and suggest next‑generation fabrication/assembly capabilities. This full‑time, exempt role reports to the COO and is located at our Salem, NH facility; preference is given to candidates within a commutable distance to Salem, NH.

Responsibilities

• Perform all aspects of package design and verification through the NPI and engineering change process to deliver robust, manufacturable solutions, leveraging full understanding of product performance, material implications, project costs, and design for manufacture.
• Develop and document manufacturing techniques, materials, tools, and processes related to back‑end photodiode assembly.
• Perform analyses and select techniques to solve problems and enhance product yield and process flows.
• Establish high‑yielding, cost‑effective processes based on product need and customer requirements.
• Develop and execute Design of Experiments (DOE) for process optimization utilizing appropriate statistical analysis.
• Evaluate and validate process and design alternatives based on product manufacturability.
• Provide technical leadership to a manufacturing engineer to drive a new product or process into manufacturing.
• Deliver processes that are robust and repeatable against product specifications and that support the quoted cost.
• Lead the design and manufacturing team in improving and streamlining existing processes for increased package assembly quality and reduced assembly time.
• Mentor junior staff.
• Other duties as assigned by your manager.

Requirements

• BS in mechanical engineering, material science, or closely related technical discipline with at least 8 years of industrial experience in semiconductor or photonics die packaging.
• Fluent with material properties, packaging techniques, and manufacturing disciplines including die attach methods, wire bonding, flip chip die attach, seam seal, laser mark, and related qualification techniques.
• Demonstrated experience working with diverse engineering disciplines.
• Strong manufacturing experience ensuring high yield along with controlled process.

Preferred qualifications

• MSME with 6+ years of direct semiconductor or photonics die packaging experience.
• 5+ years of technical leadership experience in cross‑functional teams.
• Design for Six Sigma practices including Root Cause Analysis, Design of Experiments, etc.
• General awareness of FEA‑based analysis techniques as related to photonics and PIC package designs.

Additional requirements

• Able to lift up to 20 lbs.
• Travel may be required, likely less than 10%.
• Must wear complete fab attire for an entire shift and meet all safety and cleanroom requirements, including: hand hygiene, personal item removal, gowning area preparation, order of gowning, shoe covers, hair covers, face masks, coveralls/gowns, gloves, additional garments, final inspection, and maintaining proper protocols.

About GPD

At GPD Optoelectronics, we believe that by operating with integrity and trust we drive constant organizational improvement, which strengthens our relationships with our employees and customers. Customer success remains our highest priority, so we strive to deliver high‑quality products on time and provide unparalleled service, responsiveness, and collaboration. Founded in 1973 as Germanium Power Devices Corp, we began by making high‑quality germanium transistors. Since the early 1980s we have earned our place as a trusted manufacturer of both germanium and indium gallium arsenide photodiodes. We are located in Salem, NH.