Senior NPI Engineer

Aurora’s mission is to deliver the benefits of self-driving technology safely, quickly, and broadly. The Aurora Driver will create a new era in mobility and logistics, one that will bring a safer, more efficient, and more accessible future to everyone. At Aurora, you’ll tackle massively complex problems alongside other passionate, intelligent individuals, growing as an expert while expanding your knowledge.

About the role

The Senior Engineer on the Hardware NPI Engineering team is responsible for shepherding hardware from concept review to low-volume manufacturing. You will guide design engineers in selecting appropriate manufacturing processes and be on the floor through each build to deliver finished vehicle integrations, electronic sensors and modules, and computers.

Responsibilities

• Support transition of critical automated micro-optical alignment from engineering to high-volume manufacturing at CM.
• Ensure end-to-end assembly process readiness for complex lidar systems at manufacturing partners.
• Yield analysis monitoring and drive continuous improvement initiatives for NPI production lines to achieve capacity and cost targets.
• Maintain product quality by improving design and manufacturing processes as well as equipment stability.
• Provide onsite engineering support, including technical ownership for process or equipment issues.
• Provide feedback on manufacturing and service requirements, process control plans, and quality assurance.
• Develop hardware standards and design guidelines.
• Own control plans, manufacturing BOM, and necessary documentation to transfer hardware from design to production.
• Review data packages before release for manufacturing.
• Create and maintain work instructions, standard operating procedures, forms, records, checklists, process sequence/routing, Process Flow Diagrams (PFD), PFMEAs, and other required manufacturing documentation.
• Support and guide the manufacturing team through all phases of Advanced Product Quality Planning (APQP), particularly later phases associated with designing and validating the manufacturing process (e.g., MSAs, production trial runs, Run @ Rate, PPAPs, control plans).
• Research manufacturing fabrication and processes new to the company and guide design engineers on their use; create Requests for Quotation/Proposal when necessary.
• Act as a liaison between module, integration, electrical teams, and cross-functional teams for planning, logistics, and ad hoc requests; organize cross-functional design reviews.
• Lead or participate in Kaizen activities to ensure continuous improvement in processes, products, components, raw materials, and equipment.
• Quickly come up to speed on new technologies and engineering challenges.
• Conduct multidisciplinary rapid problem-solving activities and propose solutions for prototype and production manufacturing challenges, such as Design for Excellence (DfX) input (e.g., Design for Manufacturing, Design for Assembly, Design for Cost/Procurement, Design for Inspection/Test, Design for Service/Repair/Maintenance).
• Work with internal production and external CMs; communicate clearly both verbally and in writing.
• International travel 20-35%, concentrated around line bring-up.
• Evening conference calls with CM in Asia 2-3 times a week.

Requirements

• Minimum of 8 years experience in an engineering role with experience working in low to high-volume production environments.
• Experience with launching hardware products and the product lifecycle, including selecting the right-sized process based on program needs.
• Experience in relevant fields: optical alignment process development, optical interconnect, chip-to-chip coupling, and FAU alignment.
• Participation in bringing new technology from R&D to high-volume manufacturing.
• Proficient in SPC, Six Sigma, and quality control processes; good understanding of machine and process interactions.
• Ability to work independently, deliver results promptly, communicate effectively, operate with a sense of urgency, and thrive in a fast-paced environment.
• Experience working with supply chain and vendors; bonus points for experience in design engineering and new product introduction.
• Working knowledge of GD&T.
• Experience with 3D CAD and PDM/PLM, preferably Catia/Solidworks and Enovia/EPDM.
• Ability to thrive in a high-output, constantly evolving environment wearing many hats, from concepts to sustaining engineering.
• Extensive design experience to successfully collaborate with cross-functional partners like internal design teams and external CMs.

Qualifications

• Bonus points for experience in AV, robotics, or the automotive industry.
• Experience in optical, electro-optical, and opto-mechanical assembly and manufacture.
• Knowledge in Flip Chip Packaging, multi-chip modules, hybrid bonding, Optical Connector Assembly, or Optical Connector to chip attach.
• Hands-on experience working with packaging/bonding machines and optimizing process recipes.
• Knowledgeable in DFx, FMEA process, and failure analysis methodologies.
• Experience with materials, adhesives, thermal/mechanical interactions, and reliability considerations in optical hardware.
• Know-how of yield analysis and process cycle time reduction methodology.
• Experience working with OSAT in a volume manufacturing environment, as well as a background in the semiconductor or optical communication industry.

Pay

The base salary range for this position is $115,000 - $184,000 per year. Aurora’s pay ranges are determined by role, level, and location. Within the range, starting base pay will be determined based on job-related skills, experience, qualifications, relevant education or training, and market conditions. The successful candidate will also be eligible for an annual bonus, equity compensation, and benefits.

Schedule

• Hybrid work environment with in-office requirements at least 3 days per week.
• International travel 20-35%, concentrated around line bring-up.
• Evening conference calls with CM in Asia 2-3 times a week.