Senior Engineer, Semi Packaging Engineering

Duties

• Work with cross-functional team to develop advanced integrated circuit ("IC") packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups.
• Perform component or system level mechanical stress and thermal simulations.
• Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification.
• Document manufacturing process flows and control plans for IC packages at company’s external suppliers.
• Work with quality and reliability groups to establish the reliability criteria and qualification plan for various end applications.
• Communicate complex engineering ideas to global teams simply and effectively, as rooted in engineering principles.

Requirements

• Must have a Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field (willing to accept a foreign education equivalent).
• Must have two (2) years of experience as a Packaging Engineer or related occupation conceptualizing and productizing semiconductor devices to bridge analog signals to digital Cloud.
• Must possess the following (quantitative experience requirements not applicable to this section):
• DE performing deep dive in 3D CAD tools (SolidWorks) and FEA software ANSYS.
• DE performing semiconductor IC or electronics assembly.
• DE in IC package design, optimization, and manufacturing.
• DE in IC package reliability requirements, failure analysis techniques, or assembly process issues.
• DE in CAD tools such as Autocad.

Qualifications

None specified in the job posting.

Skills

None specified in the job posting.

Benefits

None specified in the job posting.

Pay

$103,210 - $143,400 per year [multiple openings]

Schedule

1st Shift/Days