Senior Advanced Semiconductor Engineer

About the role

Own the development and optimization of cutting-edge semiconductor technology nodes at the intersection of device design, process technology, electrical characterization, and yield engineering. Tune fabrication conditions to meet strict electrical and reliability targets for silicon-based microelectromechanical systems (MEMS) sensor technologies used in medical, commercial, industrial, automotive, defense, and space applications. This role combines innovative research with practical engineering applications to advance sensor technologies.

Responsibilities

• Develop sensor chip designs for pressure, air flow, liquid flow, magnetic, chemical, and electrochemical sensing.
• Define, document, and optimize integrated front-end and back-end process flows for new technology nodes.
• Assist with electrical characterization of MEMS devices under development, leveraging semiconductor device physics to drive performance, parametric Cpk improvements, and overall yield.
• Coordinate with specialized teams—including Lithography, Etch, Thin Films, CMP, and Metrology—to execute experiments and resolve integration issues.
• Plan and execute Design of Experiments (DOE), analyze yield data, identify root causes of parametric outliers, and define corrective actions.
• Support the scale-up and transfer of advanced technologies from R&D to High-Volume Manufacturing (HVM).
• Partner with reliability and failure analysis (FA) teams to diagnose electrical failures and validate device robustness.

Requirements

You must have:

• Minimum B.S. in Electrical Engineering, Materials Science, Physics, or a related field (M.S. or Ph.D. preferred for advanced R&D).
• Minimum of 7 years of hands-on experience in semiconductor fabrication, process integration, device engineering, and device characterization.
• Experience with process integration and design, especially for MEMS pressure sensors.
• Deep understanding of semiconductor device physics, the interaction of various semiconductor unit processes, and device testing.
• Familiarity with semiconductor fabrication processes (diffusion, implant, wet, photolithography, plasma, metal deposition, parametric testing, saw).
• U.S. Person status (U.S. citizen, U.S. permanent resident, or protected status under asylum/refugee status, or ability to obtain export authorization) due to compliance with U.S. export control laws.

We value:

• Proficiency with statistical analysis and data mining tools (e.g., SPC, JMP, YieldMiner, or similar).
• Strong project management, interpersonal, and cross-functional leadership capabilities to align multiple engineering modules toward a common product goal.

Benefits

• Performance-driven salary.
• Employer-subsidized Medical, Dental, Vision, and Life Insurance.
• Short-Term and Long-Term Disability coverage.
• 401(k) match.
• Flexible Spending Accounts and Health Savings Accounts.
• Employee Assistance Program (EAP) and Educational Assistance.
• Parental Leave and Paid Time Off (for vacation, personal business, sick time, and parental leave).
• 12 Paid Holidays.