RFIC Thermal Engineer

Responsibilities

• Develop thermal models for RFIC devices, packages, and modules to evaluate heat dissipation and temperature distribution
• Perform thermal simulations and analysis to support design optimization and reliability improvements
• Collaborate with RFIC design and packaging teams to develop thermal management strategies
• Evaluate thermal performance across different packaging technologies and materials
• Analyze thermal failure mechanisms and recommend design or process improvements
• Document analysis methods, results, and recommendations

Requirements

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline
• 3-5 years experience with thermal analysis, modeling, or simulation in semiconductor or electronic systems
• Strong understanding of heat transfer principles and thermal management techniques for RFICs and MMICs
• Must be willing to work full-time, onsite, in Atlanta, GA

Preferred Skills

• Experience with thermal simulation tools such as ANSYS, COMSOL, or similar platforms
• Familiarity with semiconductor packaging technologies and thermal interface materials
• Experience analyzing high-power devices such as RF amplifiers or high-frequency ICs
• Strong analytical and problem-solving skills with the ability to collaborate across engineering teams