R&D Senior Process Engineer

About the role

We are seeking a R&D Senior Process Engineer to lead the materials and MEMS manufacturing development of our neural interface technologies. This role involves owning the development of our thin-film based manufacturing and materials development.

Key Responsibilities

• Lead the design and development of thin film ceramic encapsulation/insulation layers integrated with polymer films.
• Define material selection criteria and deposition strategies (ALD, PECVD, sputtering, e-beam evaporation) based on required film properties: barrier performance, dielectric strength, stress/adhesion behavior, and biocompatibility.
• Characterize film properties and analyze data from techniques such as ellipsometry, XRD, SEM/TEM, profilometry, and electrochemical impedance spectroscopy (EIS).
• Collaborate with process engineers to integrate ceramic thin film steps into a MEMS microfabrication flow (e.g., photolithography, etching, metallization).
• Develop test structures and DOEs to systematically evaluate ceramic film performance as a function of deposition parameters, thickness, and multilayer stack design.
• Author technical reports, process documentation, and IP disclosures; present findings to internal stakeholders and, where appropriate, at scientific conferences or in peer-reviewed publications.
• Stay current with emerging thin film ceramic materials and deposition technologies relevant to implantable bioelectronics, and recommend adoption where beneficial.

Qualifications

• Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field, with a research focus on thin film ceramics or dielectric materials (or M.S. with equivalent industry experience).
• 5+ years of hands-on experience with thin film ceramic deposition techniques (ALD, PECVD, sputtering, e-beam evaporation) and a deep understanding of the structure-property relationships governing film performance.
• Experience in thin film characterization methods such as ellipsometry, XRD, SEM/TEM, AFM, profilometry, and electrochemical impedance spectroscopy (EIS).
• Strong working knowledge of MEMS microfabrication processes (photolithography, dry/wet etching, metallization, wafer/substrate handling) and cleanroom experience.
• Proven ability to design and interpret test studies for evaluating encapsulation or barrier film reliability.
• Understanding of failure mechanisms in multilayer thin film stacks, including interfacial adhesion, stress management, and mechanical fatigue under flexing or cyclic loading.
• Excellent experimental design (DOE) skills and data analysis capabilities to drive process optimization decisions.
• Strong written and verbal communication skills, with experience documenting technical processes and presenting findings to cross-functional teams.

Preferred Experience

• Experience with nanolaminate or multilayer ceramic barrier stack design for moisture/ion barrier applications.
• Background in chronic in vivo or in vitro reliability testing of implantable electronics.
• Track record of peer-reviewed publications or patents in thin film ceramics, MEMS, or bioelectronics.
• Familiarity with biocompatibility and regulatory standards for implantable devices (ISO 10993, ISO13485 FDA guidance documents).
• Experience mentoring or leading small technical teams in a startup or fast-paced R&D environment.
• Familiarity with wafer-level or panel-level packaging and hermetic sealing approaches for implantable microdevices.