R&D Principal Architect, Package Substrate EDA

R&D Principal Architect, Package Substrate EDA

We Are
Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

What You'll Be Doing

• Lead R&D projects defining the architectural direction for package substrate design automation, including auto routing, power delivery network analysis, DRC engines, and database models
• Drive new technical solutions beyond incremental features, working directly with the Exec Director R&D owner for 3DIC to influence product roadmap and strategic direction
• Develop and optimize EDA software in C++, Python, and TCL to solve computational geometry and physical design automation challenges at scale
• Collaborate with cross-functional teams on database models, collateral input/output formats like ODB++, and integration with analysis tools for design validation
• Partner directly with foundries and assembly and test companies to implement emerging package substrate technologies and design methodologies, translating manufacturing constraints into tooling requirements
• Provide technical mentorship and architectural guidance to engineering teams, raising the technical bar across substrate design automation projects
• Communicate complex technical tradeoffs and architectural decisions to senior internal leaders and customer technologists, shaping how Synopsys and the industry approach advanced packaging challenges

The Impact You Will Have

• Define the technical architecture for next-generation package substrate design tools that will be used across the semiconductor industry
• Enable customers to design more complex, higher-performance package substrates by solving automation bottlenecks in routing, power integrity, and design rule validation
• Influence Synopsys product strategy and R&D investment decisions in the 3DIC and advanced packaging domain
• Accelerate time-to-market for advanced packaging technologies by building tighter collaboration models between EDA tools and manufacturing partners
• Raise the technical capability of engineering teams through mentorship and architectural leadership, creating leverage beyond your individual contributions
• Shape industry standards and best practices for package substrate design methodologies through direct engagement with foundries and OSAT partners
• Drive adoption of new Synopsys capabilities in package substrate design, directly affecting customer success in high-stakes production programs

What You'll Need

• Deep hands-on experience in package substrate design automation, including physical design, auto routing, DRC, power delivery network analysis, and design-for-manufacturing
• Strong programming skills in C++, Python, and TCL, with a track record of building production-quality EDA software
• Proven experience leading R&D projects that resulted in new architectural solutions, not just feature development or flow integration
• Extensive knowledge of computational geometry algorithms and their application to physical design automation problems
• Understanding of schematic-driven layout methodologies for package designs and the data models that connect electrical and physical domains
• Experience working directly with foundries and assembly and test companies to implement new package substrate technologies and translate manufacturing requirements into design automation
• Familiarity with design rule manuals, technology files, and ODB++ output formats for substrate manufacturing and design validation is a strong plus
• Bachelor's or Master's degree in Computer Science, Electrical Engineering, or a related field, or equivalent practical experience

Who You Are

• You can walk into a technical review with a customer's chief architect or a Synopsys GM and explain a complex design automation tradeoff in two minutes without losing the nuance or the business impact
• You have a point of view on what good architecture looks like, and you push back when a proposed solution will not scale or does not address the real constraint
• You move between writing C++ code, reviewing algorithmic approaches, and discussing product strategy with executive leadership without losing context or momentum
• You mentor engineers by asking the right questions, not by giving answers, and you know when to let someone struggle productively versus when to step in
• You are comfortable with the ambiguity that comes at the start of a hard R&D problem, and you drive toward architectural clarity without waiting for perfect information
• You build relationships with external partners like foundries and OSAT companies that go beyond transactional collaboration, you become a trusted technical advisor they call when they hit a wall

The Team You'll Be Part Of

This position reports into the Executive Director of R&D who owns the 3DIC portfolio at Synopsys, directly influencing technical and product strategy for advanced packaging solutions. Your role will involve collaboration across EDA software development teams, customer-facing application engineering, and external partners including foundries and assembly and test companies. This is a senior technical leadership role with visibility across the organization and direct impact on product direction.

Benefits

• Health & Wellness
  Comprehensive medical and healthcare plans that work for you and your family.
• Time Away
  In addition to company holidays, we have ETO and FTO Programs.
• Family Support
  Maternity and paternity leave, parenting resources, adoption and surrogacy assistance, and more.
• Retirement Plans
  Save for your future with our retirement plans that vary by region and country.
• Compensation
  Competitive salaries.