Package Architect – Advanced Packaging & System Exploration

Responsibilities

Define and explore advanced package architectures for future memory systems
Perform package-level trade-off studies across SI, PI, thermals, cost, and scalability
Create hands-on package designs and models for early feasibility analysis
Run SI/PI and thermal simulations and translate results into architecture guidance
Define package requirements and act as extension architecture and engineering

Requirements

Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
10+ years of hands-on experience in package design or package-level simulation
Strong experience with package SI modeling and analysis
Ability to independently build models and drive conclusions

Preferred Qualifications

Master’s degree in a related technical field
Experience supporting architecture or pre-silicon exploration teams
Familiarity with system-level co-design across silicon, package, and board
Experience with multi-die or heterogeneous integration

The US base salary range that Micron Technology estimates it could pay for this full-time position is: $177,000.00 - $387,000.00 a year
Additional Compensation May Include Benefits, Bonuses And Equity.