Product Engineer

About the role

The Product Engineer will lead cross‑functional teams to investigate yield excursions, identify root causes, and implement timely corrective and preventive actions (CAPA) using industry‑standard engineering methodologies. You will own yield bridge activities, supporting both new product introduction (NPI) and the transition to high‑volume manufacturing, ensuring robust process scalability and sustained yield performance. Success in this role requires strong analytical capabilities, including the ability to perform complex data queries, statistical analyses, and commonality studies to drive effective troubleshooting and continuous yield improvement. The ideal candidate is detail‑oriented, data‑driven, and thrives in a fast‑paced environment focused on advanced photonics technology.

Responsibilities

• Support daily production by solving issues in real-time and leading the analysis of failures on the wafer fabrication and testing production line.
• Work closely with the R&D team to support new product introduction on next generation optoelectronic chips such as VCSEL, DFB laser, detector and photonic integrated chips for 3D sensing applications.
• Perform design/process sensitivity studies to define EPI/process spec limits.
• Coordinate correlation studies between chip, optical sub-assembly and transceiver modules to enhance design for manufacturability.
• Lead the efforts to drive production ramp-up readiness, coordinating with cross-functional teams on chip design and specs, new equipment, process flow and specs, documentation and test database infrastructure.
• Lead cross-functional teams to drive yield improvement and product cost reduction post production ramp; perform statistical data analysis and troubleshoot potential root causes for yield excursions.
• Work closely with optical sub-assembly and transceiver module teams to address issues at contract manufacturers that could be related to chip performance.
• Support cost modeling and facilitate actions/decisions towards designing and delivering cost-competitive products.
• Monitor and improve yield performance across the entire manufacturing flow, including wafer fabrication, electrical and optical testing, and reliability evaluations.
• Own yield bridge activities, providing critical support during new product introduction and the transition to high-volume manufacturing.

Qualifications

• Masters or PhD in electrical engineering, physics, materials science or equivalent knowledge/experience.
• 10+ years professional experience.
• Hands-on experience with design, process, and characterization of optoelectronic devices such as VCSEL, DFB laser, or photonic integrated chip.
• Strong statistical data analysis skills (JMP or Minitab).
• Familiarity with semiconductor wafer fab operations (Manufacturing Execution System, process and quality control, change management) in a high-volume manufacturing environment is a plus.
• Experience with optoelectronic device reliability testing and modeling is a plus.
• Strong communication skills; adept at hosting effective meetings and facilitating actions and resolving conflicts.
• Strong ability to drive actions and solutions through cross-functional teams.

Skills

• Proficiency with statistical process control, design of experiments, and database query.
• Understanding of device physics and the impact of process parameters on performance.
• Experience performing development in a manufacturing environment.
• Self-motivated, driven individual with ability to manage multiple projects in a fast-paced environment.
• Ability to communicate results in a clear, concise, and well-organized manner.

Working Conditions

• Flexibility to support a 24/7 hour manufacturing site.
• Normal office environment.
• Clean room environment.

Physical Requirements

• Ability to lift/push/pull up to 30 lbs.
• Ability to work in a clean room environment.
• Ability to sit/stand for up to 4 hours at a time.