Process Technician (Plating) (48430)

About the role

The Plating Process Technician supports the engineering teams in the plating, wet etch, and stripping process areas. They assist with wet etch process, prepare and maintain recipes, review and document processes, expedite and disposition prototype wafers, and assist with process development experiments.

Responsibilities

• Supports the plating, wet etch, and stripping processes by preparing, maintaining, and setting up recipes to ensure an efficient and consistent process.
• Reviews and documents processes and procedures; partners with engineering to implement changes effectively.
• Expedites and dispositions prototype wafers in the plating, wet etch and stripping areas.
• Aids engineers in running plating process development experiments, collecting and analyzing data, and recommending corrective action if required.
• Reviews and maintains process controls using SPC and prepares charts and graphs.
• Aids with routine troubleshooting and resolves basic process-related issues.
• Participates in and recommends modifications to procedures or processes in support of continuous improvement initiatives.
• Collaborates with Engineering to qualify or approve new processes or procedures.
• Creates reports, charts, or graphs on an ad-hoc or routine basis.
• Prepares daily pass down report for engineers, next shift plating process technicians, and manufacturing plating technicians.
• Responds to inquiries from other team members, managers, or departments.

Requirements

• Associates degree in Electronics or Industrial Technology and/or equivalent relevant experience.
• Two years of experience working in the semiconductor industry.
• Knowledge of semiconductor or hard disk drive (HDD) principles and processes.
• Knowledge and ability to use SPC to maintain process controls.
• Knowledge of plating, wet processes and procedures.
• Hands-on experience using metrology tools such as pH meter, Tencor Thickness Profiler, XRF, and B-H loop tools.
• Proficient in the use of Microsoft Office Applications.

Qualifications

• Knowledge of plating, wet processes and procedures.
• Ability to collect and analyze data, present findings, and recommend corrective action.
• Ability to adhere to all safety policies and procedures.
• Communicate effectively with all levels of employees and management.
• Demonstrated ability to follow routine verbal or written instructions.
• Demonstrated problem-solving and organizational skills.
• Demonstrated time management and prioritization skills.
• Skilled at resolving issues quickly and efficiently.
• Flexible and able to prioritize.

Skills

• Knowledge of semiconductor or hard disk drive (HDD) principles and processes.
• Knowledge and ability to use SPC to maintain process controls.
• Knowledge of plating, wet processes and procedures.
• Hands-on experience using metrology tools such as pH meter, Tencor Thickness Profiler, XRF, and B-H loop tools.
• Proficient in the use of Microsoft Office Applications.

Benefits

Not specified.

Pay

The hourly rate for this full-time position is between $27.00-$34.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience.

Schedule

The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed.