Process Technician

Responsibilities

• Operate SEM, Dual Beam (DB), or TEM to qualify process equipment and optimize processes.
• Safely handle wafer/coupon materials while wearing required PPE.
• Use wafer maps to identify target areas of interest for analysis.
• Perform technical tests and experiments, including setup and operation of process equipment.
• Prepare records, charts, and graphs of test results.
• Adjust hardware/software parameters to correct issues or execute experiments.
• Work closely with engineering teams to troubleshoot process/integration problems.
• Perform minor electrical or mechanical troubleshooting on equipment.
• Conduct preventative and unscheduled maintenance on process equipment.

Qualifications

• Minimum of 3-4 years in semiconductor metrology; Focused Ion Beam (FIB) or Dual Beam (DB) experience preferred.
• Experience troubleshooting computers, equipment, and tools.
• Skilled in Microsoft Office (Outlook, Word, Excel, PowerPoint).
• Excellent communication, problem-solving, and self-starter mindset with strong technical and hands-on skills.

Physical Demands and Work Conditions

• Shift Requirements: Willingness to work 12.5-hour night shifts, 3-4 days per week.
• Work Environment: Majority of duties performed in front of a computer; some require PPE (latex/nitrile gloves, safety glasses, safety shoes, bump cap).
• Physical Activity: Walking up to/exceeding 10,000 steps per shift, including multiple flights of stairs.
• Vision Requirements: Close vision, color vision, peripheral vision, depth perception, and ability to adjust focus.
• Mechanical Aptitude: Manual dexterity and ability to lift/carry up to 35 pounds; may involve bending, stooping, crawling, or climbing.
• Safety Procedures: Adherence to industry safety standards when working with chemicals, electric currents, high voltage, moving mechanical parts, or radiation.
• Travel: Occasional travel to TEL factories, training facilities, and customer locations.