Process Integration and Yield Technician (ICE)

About the role

Intel’s Wafer Packaging Manufacturing organization supports semiconductor wafer processing, testing, and die-to-wafer assembly. We are seeking two ORAP (Oregon Advanced Packaging) Integration Yield Technicians to provide manufacturing sustaining and engineering development support across HBI, WLA, Die Prep, and TSVr. You will work closely with integration engineers, factory operations, and cross-functional teams to resolve material issues, contain process excursions, and keep work in process moving safely through the factory. This hands-on role combines real-time troubleshooting